STMicroelectronics, recently announced a new MCP (multichip package) memory portfolio designed to meet the needs of multimedia applications in 3G and CDMA mobile phones, and in other portable devices, where memory requirements are high and space and power are limited.
The series offers memory densities up to 1-Gbit of NAND Flash with up to 512-Mbit of LPSDRAM (low-power synchronous dynamic RAM) in a single package, and has been developed in close cooperation with chipset enablers and operating system vendors to ensure that it matches the requirements of phone manufacturers and is compliant with the major mobile platforms.
Multichip packages mount two (or more) chips in a single package to minimise the space required in critical applications, while increasing the memory density and offering the necessary different memory types. The NAND Flash and LPSDRAM components have separate power supplies and ground lines, as well as separate control, address and I/O signals, to allow simultaneous access to both chips.
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