DSP, Micros & Memory


Heatsinks to suit a variety of microprocessor types

19 September 2007 DSP, Micros & Memory

Alutronic offers a range of heatsinks for microprocessors in various contact types including BGA (ball grid array) and PGA (pin grid array). With a highly thermally conductive self-adhesive foil, these heatsinks support direct mounting and offer optimal heat radiation thanks to their black anodised surface finish.

The range includes a variety of sizes and heat transfer characteristics. The PG range is made from profile aluminium using extrusion technology and achieves thermal conductivity of 180 to 200 W/mK, while the PB range is made from pure aluminium using cold forging technology and achieves thermal conductivity of 210 to 236 W/mK, thanks to its high material density.



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