FCI has expanded its new ZipLine connector system with the addition of the ZipLine power module.
Designed for both backplane and orthogonal applications, the power IMLA (insert-moulded leadframe assembly) has a current-carrying capacity of 7 A per position, or 42 A per column, as tested for 30°C temperature rise in still air when a single 6-contact power IMLA is integrated within a signal module.
The ZipLine high-density, high-performance connector system is built upon FCI's proven AirMax VS technology and offers similar signal integrity performance. Like AirMax VS connectors, the ZipLine connector system uses edge-coupling technology to deliver high signal density with low insertion loss and low crosstalk, all without the use of costly and space-consuming metal shields. Data rates can scale from 2,5 Gbps to 12,5 Gbps without requiring redesign of a basic platform.
ZipLine connectors also provide high signal density in three dimensions to help address mechanical and thermal concerns of system designers. The system is compatible with hard metric design practice and can be placed next to AirMax VS signal modules and hard metric high-power connectors. With two adjacent power IMLAs, the ZipLine power IMLA's current-carrying capacity is 5 A per contact position, or 30 A per column. With 12 adjacent IMLAs, individual contacts are rated at 2,5 A, or 15 A per column.
The ZipLine connector system provides 33,3 differential signal pairs per centimetre linear density when configured with six differential pairs per column at 1,8 mm column pitch, and can attain 39,8 differential signal pairs per centimetre at 1,5 mm column pitch.
NXP has expanded its MCX A Series Altron Arrow
AI & ML
NXP has significantly expanded its MCX A Series of Arm Cortex-M33 microcontrollers, doubling the portfolio with six new families aimed at industrial and IoT edge applications.
Read more...Omniball through-hole contacts Spectrum Concepts
Interconnection
Mill-Max has introduced an expansion to its Omniball spring-loaded contact range with a new series of through-hole mount Omniball pins designed for robust and versatile interconnect solutions.
Read more...Exploring Bluetooth Channel Sounding Altron Arrow
Telecoms, Datacoms, Wireless, IoT
NXP has enabled BCS on the MCX W72 multi-protocol wireless MCU, which supports Bluetooth Low Energy 6.0, Thread, Zigbee, and Matter.
Read more...Dual-band Wi-Fi 6 companion module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The SimpleLink Wi-Fi CC33xx family of devices from Texas Instruments are dual-band Wi-Fi 6 companion modules enabling engineers to connect more applications with confidence.
Read more...High-performance linear regulator Altron Arrow
Power Electronics / Power Management
The TI TPS7A57-Q1 is an automotive-grade, high-performance low-dropout linear regulator, engineered for precision power delivery in noise-sensitive systems.
Read more...Quad RF ADC/DAC for wideband transceiver design Altron Arrow
DSP, Micros & Memory
The AD9084 from Analog Devices integrates a quad 16-bit RF digital-to-analogue converter with a maximum sampling rate of 28 GSPS and a quad 12-bit RF analogue-to-digital converter.
Read more...Phoenix’s Push-X range is growing Phoenix Contact
Interconnection
With the new XT 1,5 terminal blocks, Phoenix Contact is extending the series to include versions for conductor cross-sections from 0,34 to 2.5 mm2.
Read more...Connector range for demanding environments Future Electronics
Interconnection
TE Connectivity’s DEUTSCH connector range offers high-performance interconnect solutions engineered for demanding environments where reliability and durability are essential.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version