NXP Semiconductors has announced new fully integrated interface conditioning chips for the HDMI 1.3 port.
The new family of chips deliver 8 kV of ESD protection (according to the IEC61000-4-2 standard), as well as DDC buffering, hot plug control, an enable signal for HDMI port switching and CEC ringing prevention. The IP4777CZ38, designed for sources such as DVD players, and the IP4778CZ38, designed for sinks such as TV sets, also offer low line capacitance to ensure high signal integrity for the latest video formats such as 1080p.
Integrated functions for both devices include ESD protection of TMDS, Hot Plug, DDC and CEC lines according to the strict IEC standard. Since HDMI is a hot-plug interface, ESD protection becomes much more important with a new series of mobile HDMI devices generating several plug events each day.
DDC capacitive decoupling and EMI filtering between system side and HDMI connector side and buffering is provided to drive cables with high capacitive loads (greater than 700 pF). The devices boast fast diode switching speeds and low line capacitances of 0,7 pF to ground and 0,05 pF between the channels to ensure signal integrity.
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