Lattice Semiconductor has launched industrial temperature qualified versions of all its non-volatile LatticeXP2 FPGAs. Based on Lattice's 90 nanometre hybrid flexiFLASH technology, the XP2 family's volume production availability in industrial temperature qualified devices enables realisation of design requirements in a multitude of industrial applications such as medical imaging, robotics, human machine interface (HMI) systems, motor control and industrial displays.
The LatticeXP2 family has been fully qualified and characterised to meet industrial temperature requirements, and is available for the full range of devices, from the smallest LatticeXP2-5 through the largest LatticeXP2-40 (5 K and 40 K LUTs, respectively). Depending on the device, low cost BGA and QFP packages that meet industrial temperature requirements are also available.
Flash memory blocks are embedded within XP2 FPGAs to store the device configuration, providing a true single-chip solution. At power-up or on user command, the data stored in the Flash memory is transferred into SRAM cells that control the configuration of the device. This transfer is done in a massively parallel fashion, enabling the device logic to be available in approximately 1 ms. This ‘instant-on’ capability is critical for many system functions such as power-up sequencing, address decoding and reset logic.
Unlike traditional SRAM-based FPGAs, the LatticeXP2 device does not require an external boot memory for FPGA configuration. The absence of an external boot device also eliminates the need for an external bit stream at boot up and the possibility of bit stream snooping. Additional security features prohibit bit stream read-back from the SRAM and Flash sections of the devices.
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