Telecoms, Datacoms, Wireless, IoT


RF power LDMOS transistors

22 July 2009 Telecoms, Datacoms, Wireless, IoT

Freescale Semiconductor recently introduced three high-performance RF power transistors based on laterally-diffused metal oxide semiconductor (LDMOS) technology. The devices incorporate enhancements that make them easy to integrate into amplifiers while delivering high levels of performance.

For GSM EDGE applications, the MRFE6S9046N operates from 920 to 960 MHz and delivers a 17,8 W average RF power output with 19 dB of gain, up to 42,5% efficiency and EVM of up to 2,1% RMS. It is housed in Freescale’s over-moulded plastic package that is surface-mountable, making it compatible with automated pick-and-place manufacturing, and enhanced internal impedance matching enables manufacturers to more easily accommodate printed circuit board variations. The internal output matching enables a user-friendly terminal impedance at the fundamental frequency, but also includes second and third harmonic terminations for higher efficiency, in line with the theory of Class F amplifiers.

The MRF8S9100H/HS (920 to 960 MHz) and MRF8S18120H/HS (1805 to 1880 MHz) are 28 V devices designed for Class AB and Class C operation in GSM and EDGE systems. In GSM EDGE service, the MRF8S9100H/HS delivers 45 W average power gain of 19,1 dB and efficiency of 44% at 940 MHz, and EVM of 2% RMS. It can also be operated in the GSM 800 band. In GSM EDGE service, the MRF8S18120H/HS delivers 46 W average power gain of 18,2 dB, efficiency of 42% at 1840 MHz and EVM of 1,7% RMS. It also supports operation in the GSM 1900 frequency band.

The MRF8S9100H/HS and MRF8S18120H/HS are housed in rugged air-cavity ceramic packages. All three devices are internally matched to simplify circuit design, are RoHS compliant and contain internal ESD protection circuitry.

For more information contact Marian Ledgerwood, Future Electronics, +27 (0)21 421 8292, [email protected], www.futureelectronics.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

The trends driving uptake of IoT Platform as a Service
Trinity IoT Editor's Choice Telecoms, Datacoms, Wireless, IoT
IoT platforms, delivered as a service, are the key that will enable enterprises to leverage a number of growing trends within the IT space, and access a range of benefits that will help them grow their businesses.

Read more...
Precise multi-vital sign monitoring
Future Electronics Power Electronics / Power Management
The AS7058 by ams OSRAM is an integrated multi-vital sign monitoring device, which provides a complete photoplethysmogram, electrocardiogram, body impedance sensor, and electrodermal activity sensor.

Read more...
Reducing noise on power supply lines
Future Electronics Circuit & System Protection
Murata has introduced the EMIFIL ESD Series Noise Filters, a breakthrough solution engineered for superior noise suppression and enhanced electrostatic discharge (ESD) protection.

Read more...
Advanced 3-phase controllers
Future Electronics Power Electronics / Power Management
The STSPIN32G0 by STMicroelectronics is a family of highly integrated system-in-package providing solution suitable for driving three-phase brushless motors.

Read more...
RF power amplifier
RF Design Telecoms, Datacoms, Wireless, IoT
The ZHL-20M2G7025X+ from Mini-Circuits is a 32 W power amplifier that operates from 20 to 2700 MHz and delivers a saturated output power of +45 dBm.

Read more...
Introducing the Quectel EG800Z series
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The EG800Z series is Quectel’s latest ultra-compact LTE Cat 1 bis module, designed to deliver reliable connectivity, low power consumption, and robust performance across a wide range of IoT applications.

Read more...
MultiVolt series of oscillators
Future Electronics DSP, Micros & Memory
The ECS-3225MVQ from ECS Inc. is a compact, quartz-based MultiVolt oscillator designed for precision timing in automotive, industrial, and portable electronic systems.

Read more...
NeoMesh on LoRa
CST Electronics Telecoms, Datacoms, Wireless, IoT
Thomas Steen Halkier, CEO of NeoCortec, recently gave a keynote speech where he spoke about “NeoMesh on LoRa: Bringing true mesh networking to the LoRa PHY”.

Read more...
Drive innovation with AURIX TriCore MCUs
Future Electronics DSP, Micros & Memory
Infineon’s AURIX TriCore family balances safety, performance, and energy efficiency to offer a scalable and future-ready portfolio.

Read more...
Modules upgraded with Direct-to-Cell tech
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced that several of its LTE modules are now available with Direct-to-Cell (D2C) functionality, enabling devices to seamlessly connect to satellite networks.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved