ETX 3.0 computer-on-module offering

30 September 2009 Computer/Embedded Technology

Diamond has unveiled a family of ETX 3.0 compatible computer-on-module (COM) products, supported by an offering of development and customisation services.

The ETX COM family initially comprises the ETX-Atom – based on the low-power 1,6 GHz Intel Atom N270 processor – and the ETX-945M – offering a choice of Intel Core2Duo or Celeron M processors, clocked at up to 2,16 GHz. Both modules integrate a complete set of PC-compatible core functions, including a high-performance processor, up to 2 GB of onboard DDR2 SDRAM (SO-DIMM), and an extensive set of system controllers and peripheral interfaces.

Onboard I/O ports include high-resolution CRT and dual-channel LVDS video, 10/100 Mbps Ethernet, two x SATA, IDE, four x USB 2.0, audio in/out, two x serial, parallel, PS/2 keyboard/mouse, realtime clock and watchdog timer. The modules' inclusion of both 32-bit PCI and 16-bit ISA buses maximises application baseboard development flexibility. To accommodate applications in harsh outdoor environments, both modules are rated for operation over extended temperature ranges (-20°C to +70°C for the ETX-Atom; -45°C to +85°C for the ETX-945M).

In addition to the COMs themselves, Diamond has announced a range of development, customisation and support services to further ensure timely completion of embedded development projects. These include standard, semi-custom and full-custom ETX baseboard designs combined with carefully selected COM CPUs. Technologies available for integration into custom ETX baseboards include analog and digital I/O, counters and timers, fieldbuses, Ethernet, serial ports, USB 2.0, frame grabbers, wireless (GPS, cellular, Wi-Fi, Bluetooth, etc), relays and opto-isolation, DC-DC converters, as well as PC/104 (ISA), PC/104-Plus (PCI) and PCI Express expansion buses.

Other available value-added services include operating system, device drivers and BIOS customisation, addition of latching connectors, burn-in and screening, conformal coating, extended temperature testing, full system integration and programme management.

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