Computer/Embedded Technology


COM Express modules take the heat

31 March 2010 Computer/Embedded Technology

Diamond Systems has launched a family of COM Express 1.0 compliant computer-on-modules (COMs) based on Intel’s low-power, high-performance Atom and Core processors. Rated for operation over enhanced (-20°C to +71°C) and extended (-40°C to +85°C) temperature ranges, the modules are well suited to a broad range of fixed and mobile applications in the defence, avionics, transportation, energy management and industrial automation sectors.

Diamond’s new CME-Atom (top) and CME-965 (below) COM Express modules support wide-temperature operation
Diamond’s new CME-Atom (top) and CME-965 (below) COM Express modules support wide-temperature operation

Within the industry-standard 95 x 125 mm COM Express footprint, the CME-Atom and CME-965 each integrate an Intel processor, DDR2 SDRAM and a complete set of PC-compatible system controllers and interfaces. Both modules provide eight USB 2.0 ports, a gigabit Ethernet LAN interface, high-resolution VGA CRT and LVDS LCD video, audio in and out, and mass storage interfaces. Additionally, both provide PCI Express, 32-bit PCI and LPC expansion bus signals for connection to external generic or application-specific baseboards.



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