The VIA EPIA-T700 from VIA Technologies is the first product based on the recently announced Mobile-ITX form factor.
Measuring a mere 6 x 6 cm, it is a computer-on-module (COM) that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications.
The module can be used with a variety of carrier boards that can be adapted and customised to meet the needs of a range of applications and is powered by a specially miniaturised 1 GHz VIA Eden ULV processor and the compact VIA VX820 MSP that together offer I/O flexibility in the most compact of available form factors. The board features 512 MB of DDR2 onboard system memory. The VIA VX820 media system processor adds key features including the VIA Chrome9 DX9 integrated graphics core, the VIA Chromotion video engine with hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1 video formats, and VIA Vinyl HD Audio supporting up to eight channels of HD audio.
An integrated multiconfiguration transmitter enables display connection to TTL LCD panels and CRT monitors. Added flexibility is provided through carrier board configurations that integrate the DVP interface to include LVDS and DVI support. Other integrated data bus technologies include PCI Express and Ultra DMA. The VIA EPIA-T700 uses two unique high density, low profile connectors on the under side of the module that can also withstand vibrations of up to 5 G, making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.
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