21 July 2010Enclosures, Racks, Cabinets & Panel Products
Subracks as well as VME and CompactPCI systems are often installed above one another in the 19-inch plane of industrial cabinets. Fan trays with axial fans below the systems improve the cooling of the system positioned directly above them, but blow the hot exhaust air upwards towards the systems higher up. The result is a temperature rise in the ‘cold’ incoming air of about 10 K for each system up the height of the plane.
If one assumes an ambient temperature of 20°C, then the temperature of the air intended for cooling is already 50°C by the time it reaches the fourth system. The consequences are clear: the upper systems are inadequately cooled, performance falls and the MTBF (mean time between failures) of the electronic components is dramatically reduced.
The new Schroff airguide trays improve the heat dissipation from the vertically arranged systems by a claimed 50%. The warm exhaust air is drawn into the rear area of the cabinet and extracted through perforated doors or, in closed systems, is sucked away by a fan unit on the top panel of the cabinet. Cold air is introduced from the front. Cold and warm air are separated from each other to a large degree. Warming of the air used for cooling becomes appreciable only from the third system level, and amounts there – and for each further system mounted above – to only about 5 K.
The airguide trays are 1 U high and are fitted on the 19-inch plane between the embedded systems to separate cool incoming air from hot exhaust air.
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