The MIC-5602 from Advantech is a highly integrated single-width, mid-size processor AMC. Its design is based on the low-power Intel Core2 Duo LV and ULV processors combined with the Intel 3100 chipset. The board includes 1 or 2 GB of soldered DDR2 400 MHz memory with ECC for higher MTBF and optimum cooling. To facilitate development, test and integration whilst offering typical network connectivity once deployed, the front panel provides a Gigabit Ethernet connector, a serial port and a USB 2.0 host port.
The board can be configured with two PCI Express x4 ports or a single PCI Express x8 port to the edge connector. Two Gigabit Ethernet ports provide AMC.2 compliance and connect to the 3100 chipset via PCI Express for maximum data throughput. Dual SATA interfaces provide AMC.3-compliant storage and two USB ports offer further connectivity opportunities. A dedicated module management controller (MMC) monitors onboard conditions and manages hot swap operation for field upgrades or module replacement without the need to power down the underlying system.
Vertiv expands rack PDU portfolio
Computer/Embedded Technology
Vertiv has announced its new Vertiv PowerIT rack power distribution units designed to address the rising power needs of data-intensive workloads, including AI and high-performance computing.
Read more...Rugged PoE switch built for industrial demands Conical Technologies
Computer/Embedded Technology
The rugged Planet IGS-5225-8P4S-12V comes in a compact, rugged, and highly efficient design, making it the switch of choice for engineers working in harsh environments.
Read more...High-performance networking for demanding environments Electronic Products Design
Computer/Embedded Technology
The Raptor-Epsilon Ethernet switch system is a ruggedised networking solution engineered to deliver advanced switching capabilities, superior reliability, and energy-efficient operation in the most demanding environments.
Read more...Rugged, I/O-rich NVIDIA Jetson solutions Electronic Products Design
Computer/Embedded Technology
Developed for the NVIDIA Jetson AGX Orin, the Osbourne carrier and development kit is a compact and rugged platform designed to support a wide range of embedded AI and edge computing applications.
Read more...New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.
Read more...Smallest 13th gen Intel SBC Vepac Electronics
Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.
Read more...Versatile PoE extender Vepac Electronics
Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...QuecPi smart development board iCorp Technologies
Computer/Embedded Technology
The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version