13 October 2010Manufacturing / Production Technology, Hardware & Services
Juki has announced the release of its KE-1070/KE-1080 modular placement systems that are intended to meet the need for reliable, cost-efficient placement solutions for the mid-range market. The systems are built using the same topology as the already established KE-2070/KE-2080 machines.
The KE-1070 has a four-nozzle head with a rated IPC9850 speed of 15 500 CPH and a component placement range from 01005 (0402 metric) to 33,5 mm². The KE-1080 adds a fifth nozzle to handle larger parts and uses a tri-coloured advanced vision system featuring blue, green and red LEDs for accurate placement of fine-pitch ICs, connectors and odd-shaped components. Additionally, the KE-1080 has an IPC9850 rated speed of 14 100 CPH for chips, and 3400 CPH for IC components when using the advanced lighting system. The effective component placement range for the KE-1080 is 01005 (0402 metric) to 74 mm² or 50 x 150 mm.
The machines use the LNC60 optical centring laser that is built into the head to measure components while moving from the pick site to the placement site. This eliminates the need to move to a stationary or line scan camera, creating an efficient method of component measurement centring. The LNC60 is not affected by the colour of a part and can easily transfer a part profile back to the database. Other important features of the LNC60 laser include the ability to detect the exact height of the nozzle tip, bent nozzle detection and a tombstone pick check. Additionally, the laser ensures that a component is present before placement and that the component has been placed successfully.
The KE-1070 and KE-1080 are compatible with all current Juki feeders and trolleys. The mounters feature powerful line optimisation software and rugged trolley carts that make changeover quick and easy. They also feature an auto-pick correction feature that minimises setup time and ensures accurate picking of even the smallest components, as well as a BGA auto-teach feature that allows the operator to automatically learn the ball or lead pattern on BGAs and QFPs.
World-first 016008 mm component placement
Manufacturing / Production Technology, Hardware & Services
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.
Read more...Lifecycle and obsolescence: Protecting electronics through process Production Logix
Manufacturing / Production Technology, Hardware & Services
At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.
Read more...Maximising squeegee quality and durability Testerion
Manufacturing / Production Technology, Hardware & Services
Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.
Read more...NeoDen ND2 PCB screen printer ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.
Read more...Understanding the BGA rework process Techmet
Manufacturing / Production Technology, Hardware & Services
BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
Read more...Flexible three-process reflow soldering system Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
Read more...Inline vapour phase soldering for high-volume production MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.
Read more...Global electronics solutions since 1964 IMP Electronics Solutions
Manufacturing / Production Technology, Hardware & Services
Over more than six decades, IMP Electronics Solutions has built a reputation for technical expertise, reliable supply chains, and strong partnerships with both customers and manufacturing partners.
Read more...Driving excellence in electronics manufacturing Jemstech
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Jemstech’s reputation for disciplined execution and client-focused service has earned it strong loyalty from companies operating in demanding industries.
Read more...When do you need Nitrogen in reflow? Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
Nitrogen in reflow soldering is often seen as a performance enhancer, offering improved wetting, shinier joints, and fewer defects. But it is not always necessary.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version