HSPA M2M module
13 April 2011
Telecoms, Datacoms, Wireless, IoT
Telit Wireless Solutions is launching the Telit HE863 – the first model in a new module series. The device is a fully equipped HSPA M2M module in a ball grid array (BGA) form factor with embedded GPS receiver. It is aimed at data transmission devices with a long lifetime that are intended for long-term use even after 2G network switch-off and require high throughput. Examples include smart metering, healthcare, surveillance and tracking applications.
Smart metering devices such as electricity and water meters have been in use for several years. For this reason, many manufacturers are already using 3G data transmission to future-proof their products against non-availability of the 2G network. Previously Telit only offered 3G technology in connectorised products. To complete the product range, the HE series now includes 3G modules with BGA technology for the first time.
The HE863 measures a compact 31,4 x 41,4 x 2,9 mm. The solder balls are spaced further apart than with most other BGA systems (2/2,5 mm compared with 0,8/0,5 mm), making for easier assembly. All models in the series have the same footprint for maximum compatibility.
The module supports quad-band GSM, GPRS/EDGE multislot class 33, 3GPP stack Release 6 and dual-band HSPA with 5,76 Mbps (uplink) and 7,2 Mbps (downlink). There are three pin-compatible variations of HSPA (900/2100, 850/1900 and 850/2100) to enable global use. Telit supplies the module with an optional embedded GPS/A-GPS receiver. All models in the HE series, which will be launched in stages between now and mid-2011, are designed for low power consumption. The modules can be used in a temperature range of -30°C to
+85°C.
As with all Telit modules, the HE series features Premium FOTA Management for fast, secure and reliable over-the-air firmware updates. Telit also supports customers by developing custom products and features such as special AT commands.
For more information contact Pieter Lentz, Telit Wireless Solutions, +27 (0)11 367 0607, [email protected], www.telit.com
Further reading:
Strategic agreement for eSIM solutions
Avnet Silica
Telecoms, Datacoms, Wireless, IoT
This agreement between Avent Silica and Thales covers the latter’s eSIM solutions that are compliant with GSMA SGP.22 and SGP.32 standards.
Read more...
High precision multi-GNSS antenna
RS South Africa
Telecoms, Datacoms, Wireless, IoT
The Amphenol PCTEL GNSS-L125-DH-NF multi-GNSS antenna is a high-performance antenna designed for reliable global navigation satellite system reception in demanding environments.
Read more...
Designing IoT devices for deterministic LPWAN environments
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Built on Ultra Narrow Band communication technology, the Sigfox network focuses on low power, wide area M2M connectivity rather than maximising data throughput.
Read more...
Robust LoRaWAN for distributed IoT
CST Electronics
Telecoms, Datacoms, Wireless, IoT
InHand Networks has unveiled its latest LoRaWAN gateway, the EC312, marking an evolution in industrial-grade connectivity solutions for distributed IoT environments.
Read more...
Miniaturised tuneable harmonic filter bank
RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
Modern RF and microwave communication systems require compact, high power filtering solutions to suppress unwanted harmonic signals generated by power amplifiers, and to address this challenge, Tri-TeQ has developed a miniaturised broadband tuneable harmonic switched filter bank.
Read more...
Nordic accelerates cellular IoT leadership
RF Design
Telecoms, Datacoms, Wireless, IoT
The company unveiled its next-generation portfolio featuring Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI, delivering secure and resilient connectivity across billions of IoT devices.
Read more...
Powering the future of industrial automation
IOT Electronics
Telecoms, Datacoms, Wireless, IoT
5G, the 5th generation of wireless broadband technology, enables users to establish reliable connectivity, which in turn enables flexible, autonomous, and efficient processes from production to logistics.
Read more...
Wi-Fi 7 tri-band connectivity module
iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has introduced the FCE870Q, a compact short range wireless connectivity module designed for next generation IoT devices that require high throughput, low latency, and reliable operation in dense wireless environments.
Read more...
Compact cellular IoT SiP with GNSS
RF Design
Telecoms, Datacoms, Wireless, IoT
Combining low-power connectivity, edge processing, and positioning capabilities in a compact module, Nordic’s nRF9151 targets applications such as asset tracking, smart metering, industrial monitoring, and smart city infrastructure.
Read more...
Enabling the next generation of high-performance wireless designs
iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has expanded its wireless connectivity portfolio with the introduction of the ESP32-E22, a high-performance connectivity co-processor designed for next generation embedded and IoT systems.
Read more...
printer friendly version