HSPA M2M module

Telecoms, Datacoms, Wireless, IoT

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13 April 2011 Telecoms, Datacoms, Wireless, IoT

Telit Wireless Solutions is launching the Telit HE863 – the first model in a new module series. The device is a fully equipped HSPA M2M module in a ball grid array (BGA) form factor with embedded GPS receiver. It is aimed at data transmission devices with a long lifetime that are intended for long-term use even after 2G network switch-off and require high throughput. Examples include smart metering, healthcare, surveillance and tracking applications.

Smart metering devices such as electricity and water meters have been in use for several years. For this reason, many manufacturers are already using 3G data transmission to future-proof their products against non-availability of the 2G network. Previously Telit only offered 3G technology in connectorised products. To complete the product range, the HE series now includes 3G modules with BGA technology for the first time.

The HE863 measures a compact 31,4 x 41,4 x 2,9 mm. The solder balls are spaced further apart than with most other BGA systems (2/2,5 mm compared with 0,8/0,5 mm), making for easier assembly. All models in the series have the same footprint for maximum compatibility.

The module supports quad-band GSM, GPRS/EDGE multislot class 33, 3GPP stack Release 6 and dual-band HSPA with 5,76 Mbps (uplink) and 7,2 Mbps (downlink). There are three pin-compatible variations of HSPA (900/2100, 850/1900 and 850/2100) to enable global use. Telit supplies the module with an optional embedded GPS/A-GPS receiver. All models in the HE series, which will be launched in stages between now and mid-2011, are designed for low power consumption. The modules can be used in a temperature range of -30°C to

+85°C.

As with all Telit modules, the HE series features Premium FOTA Management for fast, secure and reliable over-the-air firmware updates. Telit also supports customers by developing custom products and features such as special AT commands.

For more information contact Pieter Lentz, Telit Wireless Solutions, +27 (0)11 367 0607, pieter.lentz@telit.com, www.telit.com

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HSPA M2M module

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