11 May 2011Manufacturing / Production Technology, Hardware & Services
ECD’s Temprobe is a precision temperature sensing instrument for thermal profiling of printed circuit boards. The subminiature thermocouple tip can be placed anywhere on a board, including profiling in wet solder paste or on fine-pitch component legs. Temprobe is used in place of a conventional thermocouple to monitor the temperature of critical solder joints or components in soldering and rework processes. It is compatible with all thermal profilers.
Also available is the Dual Flex Temprobe which is specifically designed for very low-profile thermal profiling applications; at only 12,7 mm in height (surface of board to ball top) it can meet demanding height restrictions. With its dual flex rods, length and lateral adjustments are quick and easy. The user can place multiple units together to reduce the number of runs required during the characterisation phase of product development and verification phases of production.
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