Telecoms, Datacoms, Wireless, IoT


Nordic enhances Bluetooth chip

8 February 2012 Telecoms, Datacoms, Wireless, IoT

Nordic Semiconductor announced that an enhanced revision of its nRF8001 Bluetooth 4.0 low energy connectivity IC will further extend the current device’s power-saving performance and benefit from an upgraded Bluetooth core software stack.

The revision – called the nRF8001 ‘build D’ – is fully drop-in compatible (hardware and software) with the current Nordic nRF8001 (build C) ensuring a smooth migration path for existing customers. The new power saving features and enhanced Bluetooth stack are easily accessible through an expanded ACI (application controller interface) command set that can be used by extending existing application code.

The nRF8001 build D includes all Bluetooth core stack features required for the newly adopted Bluetooth low energy human interface device (HID) profile. This makes it well suited for emerging Bluetooth low energy wireless PC peripherals and advanced navigational remotes for connected TV and set-top boxes (STB).

With its on-chip ±250 ppm 32 kHz crystal oscillator, the nRF8001 enables power-constrained applications to be implemented without an external 32 kHz crystal. This represents a bill-of-material (BoM) and board space reduction compared to competing solutions that require an external crystal. However, for the old build C version, there was a potential power consumption penalty of running on the internal oscillator versus a more accurate (typically ±20 ppm) external crystal for connection intervals of longer than about 1 second.

The new dynamic window limiting feature in build D mitigates this penalty – running on the ±250 ppm 32 kHz RC oscillator will consume similar amounts of power to running on an external ±20 ppm crystal over the entire connection interval range. Crucially, dynamic window limiting does not depend on any special features in the peer device, meaning it will offer the same performance benefits when communicating with any manufacturer’s Bluetooth v4.0 IC.

Application latency is a new feature that reduces latency for data from the central to the peripheral device in a connection using slave latency. The reduced latency means that developers can take advantage of higher slave latency while at the same time meeting all required data latency requirements, yet achieve power savings of up to 30%.

As with dynamic window limiting, application latency does not depend on any special features in the peer device, meaning it will offer the same performance benefits when communicating with any manufacturer’s Bluetooth v4.0 IC.

The Bluetooth core stack enhancements in the nRF8001 build D include: support for authenticated pairing while in bonding mode; application initiation of security request while in bonding mode; broadcast of data, plus direct advertising.

For more information contact Andrew Hutton, RF Design, +27 (0)21 555 8400, [email protected], www.rfdesign.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Full sensor to cloud solution
CST Electronics Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.

Read more...
Long-range Wi-Fi HaLow module
TRX Electronics Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.

Read more...
Quectel launches 3GPP NTN comms module
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.

Read more...
SIMCom’s A7673x series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.

Read more...
Accelerating the commercialisation of the 5G IoT markets
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
Fibocom unveils Non-Terrestrial Networks (NTN) module MA510-GL, enabling satellite and cellular connectivity to IoT applications.

Read more...
SiP supports LTE/NB-IoT and GNSS
RF Design DSP, Micros & Memory
The nRF9151 from Nordic Semiconductor is an integrated System-in-Package that supports LTE-M/NB-IoT, DECT NR+ and GNSS services.

Read more...
Long-range connectivity module
Avnet Silica Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.

Read more...
4G LTE-M/NB-IoT connectivity reference design
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Developed around the industry-leading Nordic nRF9160 module, the platform comes complete with a newly-developed LTE antenna, ATRIA, which is pre-certified to operate over the full LTE-M and NB-IoT bands.

Read more...
Antennas to meet all connectivity requirements
Electrocomp Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.

Read more...
Introducing SIMCom’s new A7673X series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.

Read more...