Telecoms, Datacoms, Wireless, IoT


Nordic enhances Bluetooth chip

8 February 2012 Telecoms, Datacoms, Wireless, IoT

Nordic Semiconductor announced that an enhanced revision of its nRF8001 Bluetooth 4.0 low energy connectivity IC will further extend the current device’s power-saving performance and benefit from an upgraded Bluetooth core software stack.

The revision – called the nRF8001 ‘build D’ – is fully drop-in compatible (hardware and software) with the current Nordic nRF8001 (build C) ensuring a smooth migration path for existing customers. The new power saving features and enhanced Bluetooth stack are easily accessible through an expanded ACI (application controller interface) command set that can be used by extending existing application code.

The nRF8001 build D includes all Bluetooth core stack features required for the newly adopted Bluetooth low energy human interface device (HID) profile. This makes it well suited for emerging Bluetooth low energy wireless PC peripherals and advanced navigational remotes for connected TV and set-top boxes (STB).

With its on-chip ±250 ppm 32 kHz crystal oscillator, the nRF8001 enables power-constrained applications to be implemented without an external 32 kHz crystal. This represents a bill-of-material (BoM) and board space reduction compared to competing solutions that require an external crystal. However, for the old build C version, there was a potential power consumption penalty of running on the internal oscillator versus a more accurate (typically ±20 ppm) external crystal for connection intervals of longer than about 1 second.

The new dynamic window limiting feature in build D mitigates this penalty – running on the ±250 ppm 32 kHz RC oscillator will consume similar amounts of power to running on an external ±20 ppm crystal over the entire connection interval range. Crucially, dynamic window limiting does not depend on any special features in the peer device, meaning it will offer the same performance benefits when communicating with any manufacturer’s Bluetooth v4.0 IC.

Application latency is a new feature that reduces latency for data from the central to the peripheral device in a connection using slave latency. The reduced latency means that developers can take advantage of higher slave latency while at the same time meeting all required data latency requirements, yet achieve power savings of up to 30%.

As with dynamic window limiting, application latency does not depend on any special features in the peer device, meaning it will offer the same performance benefits when communicating with any manufacturer’s Bluetooth v4.0 IC.

The Bluetooth core stack enhancements in the nRF8001 build D include: support for authenticated pairing while in bonding mode; application initiation of security request while in bonding mode; broadcast of data, plus direct advertising.

For more information contact Andrew Hutton, RF Design, +27 (0)21 555 8400, [email protected], www.rfdesign.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

What does Wi-Fi 7 mean for South African networks?
Telecoms, Datacoms, Wireless, IoT
With Wi-Fi 7 (802.11be), we are finally looking at a standard that was built, not just for more devices, but for the new way networks are used.

Read more...
Multiprotocol wireless SoC
RF Design Telecoms, Datacoms, Wireless, IoT
The nRF54LM20A from Nordic Semiconductor is a multiprotocol wireless System-on-Chip designed for demanding designs in Bluetooth devices.

Read more...
High performance communication
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel’s FCS950R is a high-performance Wi-Fi 5 and Bluetooth 4.2 module that can deliver a maximum data rate up to 433,3 Mbps in 802.11ac mode.

Read more...
Expanded STM32WL3x line for IoT sensors
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The STM32WL31x and STM32WL30x are more tailored versions of the STM32WL33x for designers who wish to focus on specific features, while lowering their bill of materials.

Read more...
Full-band GNSS helical antenna
RF Design Telecoms, Datacoms, Wireless, IoT
A key feature of Calian’s HC3990XF antenna design is that it does not require a ground plane, making it ideal for size-constrained applications.

Read more...
BLE and BT Mesh module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The HM-BT4531 from HOPERF is a BLE data transmission module that features an ARM Cortex-M0 32-bit processor.

Read more...
Espressif entering the Wi-Fi 6E market
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Espressif Systems is entering the Wi-Fi 6E market, extending its connectivity portfolio into the domain of high-throughput, low-latency wireless solutions.

Read more...
Ultra-low jitter clock buffers
Altron Arrow Telecoms, Datacoms, Wireless, IoT
New SKY53510/80/40 family of clock fanout buffers from Skyworks are purpose-built for data centres, wireless networks, and PCIe Gen 7 applications.

Read more...
Cutting-edge broadband power amplifier
RFiber Solutions Telecoms, Datacoms, Wireless, IoT
Designed for high efficiency and reliability, the WPGM0206012M from WAVEPIA is a cutting-edge broadband GaN MMIC power amplifier operating from 500 MHz to 8,5 GHz.

Read more...
The trends driving uptake of IoT Platform as a Service
Trinity IoT Editor's Choice Telecoms, Datacoms, Wireless, IoT
IoT platforms, delivered as a service, are the key that will enable enterprises to leverage a number of growing trends within the IT space, and access a range of benefits that will help them grow their businesses.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved