Telecoms, Datacoms, Wireless, IoT


Nordic enhances Bluetooth chip

8 February 2012 Telecoms, Datacoms, Wireless, IoT

Nordic Semiconductor announced that an enhanced revision of its nRF8001 Bluetooth 4.0 low energy connectivity IC will further extend the current device’s power-saving performance and benefit from an upgraded Bluetooth core software stack.

The revision – called the nRF8001 ‘build D’ – is fully drop-in compatible (hardware and software) with the current Nordic nRF8001 (build C) ensuring a smooth migration path for existing customers. The new power saving features and enhanced Bluetooth stack are easily accessible through an expanded ACI (application controller interface) command set that can be used by extending existing application code.

The nRF8001 build D includes all Bluetooth core stack features required for the newly adopted Bluetooth low energy human interface device (HID) profile. This makes it well suited for emerging Bluetooth low energy wireless PC peripherals and advanced navigational remotes for connected TV and set-top boxes (STB).

With its on-chip ±250 ppm 32 kHz crystal oscillator, the nRF8001 enables power-constrained applications to be implemented without an external 32 kHz crystal. This represents a bill-of-material (BoM) and board space reduction compared to competing solutions that require an external crystal. However, for the old build C version, there was a potential power consumption penalty of running on the internal oscillator versus a more accurate (typically ±20 ppm) external crystal for connection intervals of longer than about 1 second.

The new dynamic window limiting feature in build D mitigates this penalty – running on the ±250 ppm 32 kHz RC oscillator will consume similar amounts of power to running on an external ±20 ppm crystal over the entire connection interval range. Crucially, dynamic window limiting does not depend on any special features in the peer device, meaning it will offer the same performance benefits when communicating with any manufacturer’s Bluetooth v4.0 IC.

Application latency is a new feature that reduces latency for data from the central to the peripheral device in a connection using slave latency. The reduced latency means that developers can take advantage of higher slave latency while at the same time meeting all required data latency requirements, yet achieve power savings of up to 30%.

As with dynamic window limiting, application latency does not depend on any special features in the peer device, meaning it will offer the same performance benefits when communicating with any manufacturer’s Bluetooth v4.0 IC.

The Bluetooth core stack enhancements in the nRF8001 build D include: support for authenticated pairing while in bonding mode; application initiation of security request while in bonding mode; broadcast of data, plus direct advertising.

For more information contact Andrew Hutton, RF Design, +27 (0)21 555 8400, [email protected], www.rfdesign.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Wi-Fi 6 and Bluetooth LE co-processor
Altron Arrow Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.

Read more...
Improving accuracy of outdoor devices
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.

Read more...
New 3dB hybrid couplers
Electrocomp Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.

Read more...
Next-level Software Defined Radio
IOT Electronics Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.

Read more...
High-performance Zigbee and BLE module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.

Read more...
Championing local PCB manufacturing
Master Circuits Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.

Read more...
How IoT-driven smart data helps businesses stay ahead
Trinity IoT Telecoms, Datacoms, Wireless, IoT
With around 19 billion IoT devices globally, embedded in everything from machinery to vehicles to consumer products, reliable data is plentiful.

Read more...
IoT-optimised LTE Cat 1 bis module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.

Read more...
Chip provides concurrent dual connectivity
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.

Read more...
Nordic Semiconductor acquires Memfault
RF Design News
With this acquisition, Nordic has launched its first complete chip-to-cloud platform for lifecycle management of connected products.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved