Power Electronics / Power Management


Dual power MOSFET

19 February 2014 Power Electronics / Power Management

Vishay introduced a new 30 V asymmetric dual TrenchFET power MOSFET in the PowerPAIR 3 by 3 mm package utilising TrenchFET Gen IV technology. Providing 57% lower on-resistance, up to 25% higher power density and 5% higher efficiency than previous-generation devices in this package size, the SiZ340DT helps to save space and simplify the design of highly efficient synchronous buck converters by combining a high-side and low-side MOSFET in one compact package.

The technology of the SiZ340DT utilises a very high-density design to reduce on-resistance without significantly increasing the gate charge, minimising conduction losses and reducing total power loss for higher power output.

As a result, the low-side channel 2 MOSFET of the SiZ340DT offers a low on-resistance of 5,1 mΩ at a 10 V gate drive and 7,0 mΩ at 4,5 V. The high-side channel 1 MOSFET features on-resistance of 9,5 mΩ at 10 V and 13,7 mΩ at 4,5 V.

The device is optimised for synchronous buck designs in ‘cloud computing’ infrastructures, servers, telecommunication equipment, and various client-side electronic devices and mobile computing applications. The intended DC/DC blocks include system auxiliary power rails in servers, computers, notebook computers, graphic cards, gaming consoles, storage arrays, telecom equipment, DC/DC bricks and POL converters. The SiZ340DT can also be used in DC/DC conversion circuitry that supplies power to FPGAs.

In these applications, the device maintains a low gate charge of 5,6 nC for the channel 1 MOSFET and 10,1 nC for channel 2. For typical DC/DC topologies with 10 A to 15 A output current and an output voltage below 2 V, the compact footprint of the SiZ340DT saves up to 77% PCB space compared with using discrete solutions, such as a PowerPAK 1212-8 MOSFET for the high side and a PowerPAK SO-8 for the low side.

Reducing switching losses, the device allows higher switching frequencies beyond 450 kHz to shrink the PCB size, without sacrificing efficiency, by enabling the use of smaller inductors and capacitors. In addition, by providing higher performance than multiple paralleled previous-generation devices, the MOSFET can potentially reduce the overall component count and simplify designs.

For more information contact Dirk Venter, Arrow Altech Distribution, +27 (0)11 923 9600, [email protected], www.arrow.altech.co.za



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