Telecoms, Datacoms, Wireless, IoT


Low-cost 3G module

25 June 2014 Telecoms, Datacoms, Wireless, IoT

Fibocom’s H350 LGA module adopts an advanced Intel platform and supports GSM/GPRS/EDGE and UMTS/HSDPA/HSUPA/HSPA+.

Its rich application interface includes USB 2.0, UART, I2C, I2S and SPI, and a built-in TCP/IP protocol stack allows for easy integration.

The module’s industrial-grade design and manufacture conforms to the standards of ISO/TS 16949 and it can also adapt to severe working environments with high temperatures, high humidity and electromagnetic interference. Not only can it be applied to industrial fields such as vehicle navigation, security monitoring, wireless POS and remote medical services, but also to consumer electronics such as tablet PCs and e-books.

For more information contact Gerrie van Heerden, Electrocomp, +27 (0)11 458 9000, [email protected], www.electrocomp.co.za



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