Targeting small electric motors under 100 W, Fairchild’s new FSB70xxx series of advanced Motion SPM 7 modules deliver high light-load efficiency and enhanced thermal efficiency. The three-phase devices offer a full-featured, high-performance inverter output stage for AC induction, brushless DC (BLDC) and permanent magnet synchronous motors (PMSM). They integrate an optimised gate driver for the built-in MOSFETs to minimise EMI and losses, while also providing multiple on-module protection features including under-voltage lockouts, thermal monitoring, fault reporting and interlock function. Separate open-source MOSFET terminals are available for each phase to support the widest variety of control algorithms.
Microchip expands its mSiC solutions EBV Electrolink
Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
Read more...Antennas to meet all connectivity requirements Electrocomp
Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.
Read more...Introducing SIMCom’s new A7673X series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.
Read more...18 W monolithic microwave amplifier RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
The CHA8612-QDB is a two stage, high-power amplifier operating between 7,9 and 11 GHz. The monolithic microwave amplifier can typically provide 18 W of saturated output power and 40% of power-added efficiency.
Read more...LoRaWAN-certified sub-GHz module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The STM32WL5M from ST Microelectronics is the company’s first LoRaWAN-certified module which incorporates two cores, one of them being a wireless stack to optimise the creation of sub-GHz applications.
Read more...3D depth sensing sensor Avnet Silica
Telecoms, Datacoms, Wireless, IoT
A recent announcement by STMicroelectronics has revealed an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with 2,3k resolution.
Read more...Quectel announces module for RedCap comms Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
The Quectel RG255G offers downlink performance of 220 Mbps, and uplink performance of 121 Mbps on 256QAM or 91 Mbps on 64QAM.
Read more...Powering up the intelligent edge EBV Electrolink
DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...Wide-Bandgap Developer Forum Infineon Technologies
Telecoms, Datacoms, Wireless, IoT
This year marks a new chapter for this exclusive event series – all specialist presentations will be broadcasting live from a studio in Munich.
Read more...Multimode smart LTE module with GNSS Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
The AW200Z LTE module is equipped with Bluetooth and Wi-Fi functionalities, and is powered by Qualcomm's advanced 64-bit quad-core Cortex-A53 processors, coupled with an integrated Adreno 702 GPU.
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