Cypress Semiconductor’s PSoC 4 BLE programmable system-on-chip and PRoC BLE programmable radio-on-chip solutions each now have an option for a micro-ball chip scale package (CSP) optimised to bring Bluetooth Smart connectivity to secure credit card applications. The package is only 0,38 mm thick, making the reliable and fully Bluetooth-certified solutions ideal to replace chip-on-board devices. Both solutions integrate a Bluetooth Smart radio, a high-performance 32-bit ARM Cortex-M0 core with ultra-low-power modes, up to 256 KB Flash memory, 36 GPIOs, and customisable serial communication blocks, timers and counters. Additionally, both solutions have an on-chip balun that simplifies antenna design while reducing board size and system cost.
Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Bridging the gap between MCUs and MPUs Future Electronics
Editor's Choice AI & ML
The Renesas RA8 series microcontrollers feature Arm Helium technology, which boosts the performance of DSP functions and of AI and machine learning algorithms.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
Read more...Enhanced code protection for USB µC portfolio Future Electronics
DSP, Micros & Memory
To help easily incorporate USB power and communication functionality into embedded systems, Microchip Technology has launched the AVR DU family of microcontrollers.
Read more...Compact power relays Future Electronics
Interconnection
The new HE-R Series power relays by Panasonic Industry are PCB-mounted relays for easy board assembly, with both two- and four-pole contact arrangement options.
Read more...Long-range connectivity module Avnet Silica
Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.
Read more...4G LTE-M/NB-IoT connectivity reference design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Developed around the industry-leading Nordic nRF9160 module, the platform comes complete with a newly-developed LTE antenna, ATRIA, which is pre-certified to operate over the full LTE-M and NB-IoT bands.