Aimed at manufacturers of mPOS terminals, ATM keyboards, EMV card readers, contact/contactless pin pads and other mobile payment devices, Maxim Integrated Products introduced the MAX32560 DeepCover secure microcontroller (MCU).
Designers of mobile payment devices currently have to use multiple external ICs for memory expansion, contactless interface and amplifier, ISO7816 PHY, magnetic stripe interface, and battery switch functions. With the new MAX32560 DeepCover secure ARM Cortex-M3 microcontroller, these functions have been integrated into a single chip, eliminating the need for up to six external chips.
The MAX32560 embeds all the security features required to address stringent PCI-PTS requirements, including active tamper protection, scrambling keypad for PIN handling, and a secure cryptographic engine. It integrates a number of analog interfaces to reduce the PCB footprint, including a full EMV contactless reader interface, two EMV smart card interfaces, a DSP-based high performance magnetic stripe reader, 2-channel ADC, and a DAC.
The MAX32560 offers 1 MB of embedded Flash memory, 384 KB of SRAM, and 8 KB of secure NVSRAM. The memory can be further expanded through external fast serial Flash memories via a flexible QuadSPI controller with XiP, and can quickly read and decrypt code or data using an on-the-fly AES engine. For communication interfaces, the MAX32560 provides a USB device port, three SPI controllers, two UARTs and two I²C controllers. It is available in a 9 x 9 mm BGA144 package and operates across the -40°C to +85°C temperature range.
High reliability memories Altron Arrow
DSP, Micros & Memory
Infineon’s mil-temp memories offer a wide selection of volatile and non-volatile memories for applications that meet QML-Q certifications and offer support for mil-aero applications.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Artificial intelligence meets embedded development Avnet Silica
DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.
Read more...Embedded module for AI vision applications Rugged Interconnect Technologies
DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.
Read more...High-speed Flash for SoC applications NuVision Electronics
DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...ST MCUs extend ultra-low power innovation Altron Arrow
DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.
Read more...Chipset enables ultra-wide signal capture RFiber Solutions
DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.
Read more...SoC for real-time AI at the edge Future Electronics
DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.
Read more...Evaluation kit for ML applications Future Electronics
DSP, Micros & Memory
The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.