Manufacturing / Production Technology, Hardware & Services


BGA stencil templates can be used to print BGA and LGA deposits without a screen printer

5 June 2002 Manufacturing / Production Technology, Hardware & Services

Hand soldering and equipment rework specialist, Metcal, has introduced a full range of BGA stencilling templates designed for use with all its existing benchtop rework systems. Simple to use, they deposit solder balls onto the underside of a wide variety of BGA-type devices prior to placement.

Two solder printing plate options are currently available. The first is designed for components with solder balls, such as PBGAs, CBGAs, microBGAs and CSPs. The second suits the latest small land grid array (LGA) components without solder balls, also known as BCC, more commonly used in the manufacture of cellphones.

Metcal BGA stencilling templates are ideal for small components and in situations where traditional stencil access is limited by the close proximity of adjacent components. This process bypasses the time and cost required to perform the task using a stencil and screen printer and, in comparison, can increase user productivity by up to four or five hundred percent.

Reworking LGA components creates unique challenges. Variable sized pad deposits means that traditional methods cannot be used to pre-tin the substrate. The rework method, therefore, is to clean the pads after the component has been removed with solder wick or a desolder gun. The plate is then used to apply solder paste to the component in the same size and shape as originally produced on a screen printer on the production line.

Printing on the component instead of the PCB has very definite advantages. Firstly, it allows solder ball deposits on a component to be inspected prior to placement and before becoming hidden from view. In addition, by printing deposits directly on a BGA or LGA device rather than a board substrate, the risk of solder contamination due to poor PCB print quality is eliminated. Similarly, there is no chance of solder contamination into vias on the PCB due to poor stencil cleanliness.

The BGA stencilling templates themselves are extremely durable and simple to use, and will typically last much longer than stencills, while being far easier to clean. Metcal also supplies all the necessary tooling required for immediate fitting and use on their rework systems, including a stencil tooling plate, component holder and spatula for printing.



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