Flash memory company, SST (Silicon Storage Technology) has announced that its Shanghai-based subsidiary, SST China, has been selected by Shanghai HuaHong Integrated Circuit (SHHIC) as the supplier of embedded flash memory technology. SHHIC is a leading developer and promoter of smartcard technology. SST will provide its embedded SuperFlash technology in densities ranging from 256 Kb to 4 Mb to SHHIC, while SHHIC will embed SST's flash memory in a variety of its IC designs, including its next-generation smartcard ICs.
Dr Hao Min, general manager, SHHIC said, "We are very impressed with SST's SuperFlash technology, as its low power, high reliability, volume production experience and general availability through multiple leading wafer foundries in Asia make it a perfect match for our next-generation secure smartcard ICs."
Smartcards are used heavily in China, Europe and other areas of the world to store data and enable secure transactions in a wide range of application areas including banking, identification, health care, multimedia, mass transit and wireless communications. According to market research firm Gartner Dataquest, worldwide smart card shipments reached 685,4 million units in 2001, up 10,4% from 2000. SHHIC's next generation smartcard ICs are based on a 32-bit microprocessor and will be available to the industry early next year.
The nonvolatile memory technology used for manufacturing smartcard ICs has traditionally been thin-tunnel-oxide-based EEPROM technology. However, due to the large memory cell size and reliability concerns on the thin-oxide, EEPROM technology can only support smartcard applications that require a small amount of embedded memory. SST believes that its embedded SuperFlash technology is the best candidate for future generations of smartcard IC applications that require much higher density of embedded memory because the SuperFlash cell size is much smaller and the thicker oxide used in the SuperFlash technology has proven to have excellent data retention reliability in high-volume production. SST plans to further scale down its SuperFlash technology to accommodate multimegabytes of embedded memory for future smartcard IC applications.
MCUs with advanced analog peripherals 25 November 2020, Avnet Silica
, DSP, Micros & Memory
Microchip Technology’s new PIC18-Q41 and AVR DB microcontroller (MCU) families are the first to combine advanced analog peripherals and multi-voltage operation with inter-peripheral connections for increased ...
Read more...MCUs with low-power animated display driver 28 October 2020, Altron Arrow
, DSP, Micros & Memory
System developers of battery-powered and other power-conscious designs with and without LCD displays can now easily add an array of innovative features using a new line of PIC eXtreme Low Power (XLP) ...
Read more...Sub R4 microcontrollers for IoT devices and nodes 28 October 2020
, DSP, Micros & Memory
In the prevalent era of IoT technology, a local company, Climax Electronics, has been evaluating low-cost microcontrollers for IoT devices/nodes over the past year in its R&D department. These single-processor ...
Read more...Smallest automotive maXTouch controllers 29 July 2020, Altron Arrow
, DSP, Micros & Memory
To help enhance and ease today’s driving experience, automotive manufacturers are implementing additional touch displays beyond the centre infotainment display (CID). Supporting the application of these ...
Read more...New low-power MCU from Renesas 29 July 2020, Hi-Q Electronics
, DSP, Micros & Memory
The RE01-256k is the newest member of Renesas Electronics’ RE microcontroller (MCU) family, implemented on the unique silicon on thin buried oxide (SOTB) ultra-low power process from Renesas. It offers ...
Read more...New low-power MCU from Renesas 30 June 2020, Hi-Q Electronics
, DSP, Micros & Memory
The RE01-256k is the newest member of Renesas Electronics’ RE microcontroller (MCU) family, implemented on the unique silicon on thin buried oxide (SOTB) ultra-low power process from Renesas. It offers ...
Read more...MCUs for precision sensing and measurement 29 July 2020, RS Components (SA)
, DSP, Micros & Memory
A new series of single-chip devices from Renesas, the RX23E-A microcontrollers (MCUs), combine an analog front end (AFE) and an MCU core for use in equipment that delivers high-precision measurements ...
Read more...Industrial-grade 32 GB DRAM modules 29 May 2020, Vepac Electronics
, DSP, Micros & Memory
32 GB DRAM modules from Innodisk are the newest industrial-grade, high-capacity DRAM series launched with expanded capacity. Targeted at core network switches for 5G technology – touted as a much faster, ...
Read more...Microcontrollers for functional safety 29 May 2020
, DSP, Micros & Memory
As the Internet of Things (IoT) delivers greater connectivity for industrial and home applications and as connected vehicles enhance cabin and operational features, higher-performance microcontrollers ...
Read more...Enabling cloud connectivity to all Microchip MCUs and MPUs 25 March 2020
, DSP, Micros & Memory
Due to the fragmented nature of the Internet of Things (IoT) marketplace, increasing project complexity and costs, today’s developers face more challenges in design decisions than ever before. These challenges ...
printer friendly version