Power Electronics / Power Management


Integrated converter chip simplifies board development

12 March 2003 Power Electronics / Power Management

Philips Semiconductors released a new semiconductor converter that integrates five component functionalities required for a single-phase DC to DC synchronous buck converter in a single package. The PIP250M chip provides a board space saving of 20 to 30% and has the ability to convert 5 V down to between 1 and 3,3V, offering best-in-class power density for 7-15 A applications such as telecoms, data communications and enterprise computing.

Based on Philips' TrenchMOS semiconductor technology, the PIP250M chip is an expansion of Philips' powertrain portfolio. It incorporates pulse width modulation (PWM) control, drivers, control FET, Sync FET and a parallel Schottky diode in a single ready-made device. Typically, designers have to contend with the problem of multiple ICs with varying voltage needs in one design. This chip provides the solution design engineers need to deal with complex power management systems.

"Philips' PIP250M chip is designed for customers who want relief from the hassle of designing, selecting and procuring a host of separate devices for what is essentially for them, a secondary activity," said David Sharples, power product marketing manager, Philips Semiconductors. "Having identified a demand in the market for a converter in the 7-15 A range, our team developed this innovative solution that meets designers' needs and provides them with a simple solution when dealing with complex power management systems."

For more information contact Arrow Altech Distribution, 011 923 9600, Avnet Kopp, 011 809 6100, or Mutronics (Value Added Distributor), 011 608 1460.



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