Winners of the 2022 LEAP Awards (Leadership in Engineering Achievement Program) were announced earlier this week in a digital ceremony. In the category of connectivity, the Gold was awarded to Silicon Labs’ BG24 and MG24 families of 2,4 GHz wireless SoCs.
These devices feature the industry’s first integrated AI/ML accelerators and are designed for Matter, Zigbee, OpenThread, Bluetooth Low Energy, Bluetooth mesh and proprietary and multi-protocol operations. The SoCs incorporate the highest level of security certification, PSA Level 3 Secure Vault, with the best RF performance/energy-efficiency ratio in the market. They are suited for diverse smart home, medical and industrial applications.
The single-die BG24 and MG24 SoCs combine a 78 MHz ARM Cortex-M33 processor, high-performance 2,4 GHz radio, industry-leading 20-bit ADC, an optimised combination of Flash (up to 1536 kB) and RAM (up to 256 kB) and an AI/ML hardware accelerator for processing machine learning algorithms while offloading the ARM Cortex-M33. This allows applications to have more cycles to do other work with large datasets, while meeting low energy usage.
The SoC families’ new software toolkit is designed to allow developers to quickly build and deploy AI/ML algorithms at the edge using some of the most popular tool suites like TensorFlow Lite. Silicon Labs has partnered with leading AI and ML tools providers, SensiML and Edge Impulse, to ensure that developers have an end-to-end toolchain that simplifies the development of machine learning models optimised for embedded deployments of wireless applications.
Ultra-low power MEMS accelerometer Altron Arrow
Analogue, Mixed Signal, LSI
Analog Devices’ ADXL366 is an ultra-low power, 3-axis MEMS accelerometer that consumes only 0,96 µA at a 100 Hz output data rate and 191 nA when in motion-triggered wake-up mode.
Read more...ESP32-C6 achieves PSA-L2 iCorp Technologies
DSP, Micros & Memory
Espressif Systems recently announced that its ESP32-C6 microcontroller has achieved PSA Certified Level 2 (PSA-L2) security certification, making it the first RISC-V-based MCU to reach this level.
Read more...Microprocessor with integrated NPU Avnet Silica
DSP, Micros & Memory
The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.
Read more...Dual-core support in NECTO Studio
DSP, Micros & Memory
MIKROE recently announced that version 7.3.0 of its NECTO Studio Integrated Development Environment now supports dual-core MCUs, allowing designers to program and debug each core independently.
Read more...Post Quantum Cryptographic firmware library
DSP, Micros & Memory
The STM32 post-quantum cryptographic library enables developers to satisfy application requirements for any combination of data integrity, confidentiality, identification/authentication, and nonrepudiation.
Read more...Converting high voltages without a transformer Altron Arrow
Editor's Choice Power Electronics / Power Management
With appropriate power converter ICs, such as the LTC7897 from Analog Devices, many applications can be suitably powered without having to use complex and cost-intensive transformers.
Read more...MultiVolt series of oscillators Future Electronics
DSP, Micros & Memory
The ECS-3225MVQ from ECS Inc. is a compact, quartz-based MultiVolt oscillator designed for precision timing in automotive, industrial, and portable electronic systems.
Read more...Drive innovation with AURIX TriCore MCUs Future Electronics
DSP, Micros & Memory
Infineon’s AURIX TriCore family balances safety, performance, and energy efficiency to offer a scalable and future-ready portfolio.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.