Editor's Choice


Complete engineering solution for PCB assembly and test

EMP 2023 Electronics Manufacturing & Production Handbook Editor's Choice Manufacturing / Production Technology, Hardware & Services

Siemen’s Valor Process Preparation solution provides manufacturers with everything they need to run the manufacturing process accurately and efficiently, while saving costs. Valor Process Preparation offers a unique approach that creates a single, central database of all manufacturing process definitions (MPD) and engineering data, leveraging ODB++ Design and bill of materials (BOM) files.

Valor Process Preparation provides a single environment for all stages of the manufacturing process, including assembly, test, and inspection. Changes that are made during these stages are updated in a centralised location to make sure that data is always up to date. The change and revision management eliminates the need for manual, error-prone updates, which can cause inconsistency and reliability issues throughout the manufacturing process.

Manufacturing mistakes are reduced with a single data model that covers multiple processes and multi-vendor programming support. Built-in error checking, learning library, and profiles for each design centre make it easy to achieve intelligent hand-off of PCB design with a complete and accurate data model of the PCB assembly that is fully optimised for manufacturing.

A single, centralised programming resource, along with a centralised part library for all SMT machines, helps avoid a machine-specific library, which limits the manufacturer’s work flexibility and efficiency. Part libraries can be created for each machine directly from the master parts library, and custom parameters can be created or modified to enhance part and shape data.

The Valor Parts Library (VPL) is ISO 9001-certified, covering over 1 billion part numbers. It is a centralised location of all accurate shape data, pin contact area, and component classification based on the JEDEC standard.

Valor Process Preparation helps you improve yield by promoting an error-free manufacturing process. It gives you the flexibility to move between machine vendors and different manufacturing sites and to optimise your SMT programmes, which is essential for optimised productivity and manufacturing.

The application reduces work in process (WIP), increases overall equipment effectiveness (OEE) and enables you to achieve a streamlined flow in your production process. Surface mount technology (SMT), through-hole technology (THT), stencil design, hand work, box build, electrical test, and both optical and X-ray inspections, are all supported. It is easily configured for your specific workflows, including data preparation, design-for-assembly (DFA) analysis, documentation, SMT programming, test and inspection engineering, and stencil design – all in one seamless, cohesive solution.

Valor Process Preparation is the only complete process engineering solution available for PCB manufacturing.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

From the editor's desk: Is the current AI really what we want?
Technews Publishing Editor's Choice
The companies that develop LLMs need to change direction and concentrate on freeing up our time, not so that we can have more time to do the tasks we don’t want to do in the first place, but rather to allow us more time to do what we love.

Read more...
When it comes to long-term reliability of RF amplifier ICs, focus first on die junction temperature
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
When considering the long-term reliability of integrated circuits, a common misconception is that high package or die thermal resistance is problematic. However, high or low thermal resistance, by itself, tells an incomplete story.

Read more...
ICs vs modules: Understanding the technical trade-offs for IoT applications
NuVision Electronics Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.

Read more...
Why bis means business for LTE Cat 1 IoT connections
NuVision Electronics Editor's Choice Telecoms, Datacoms, Wireless, IoT
Tomaž Petaros, product manager IoT EMEA at Quectel Wireless Solutions explains why the market for Cat 1bis IoT connections is getting busy.

Read more...
Interview with Brian Aziz, vice president of global sales, Iridium
Editor's Choice
ridium is the leading satellite IoT player. Their network consists of 66 active low Earth orbit satellites covering every inch of the globe and are used for IoT and emergency services worldwide.

Read more...
PolarFire SoC FPGAs achieve AEC-Q100 qualification
ASIC Design Services DSP, Micros & Memory
Microchip Technology’s PolarFire SoC FPGAs have earned the Automotive Electronics Council AEC-Q100 qualification.

Read more...
Accelerating AI adoption in MCU manufacturing
Editor's Choice AI & ML
To gain the value of ML functionality, designers of MCU-based devices have to adopt a new development method and accept a new type of probabilistic rather than deterministic output.

Read more...
Altron Arrow: Empowering innovation with STMicroelectronics AI processors
Altron Arrow Editor's Choice AI & ML
ST’s AI processors are not only smarter and faster, but also incredibly efficient, enabling a new wave of intelligent solutions across multiple industries.

Read more...
The superpower driving the future of low carbon electricity
Editor's Choice
Modularity is a superpower. The advantage lies in smaller units that can be built, tested, refined, adapted, improved repetitively, allowing many experimentation and learning iterations.

Read more...
Eskom’s evolution sparks hope
Editor's Choice
Eskom’s evolution has sparked hope that a large corporation can change and learn to think outside the grid.

Read more...