Teledyne LeCroy has announced support for PCI Express 6.0 electrical test and validation with QPHY-PCIE6-TX-RX fully automated test software, together with SDAIII-PCIE6 and SDAIII-PAMx characterisation and debug software packages.
The growth of new technologies, including artificial intelligence/machine learning (AI/ML) and high-performance computing (HPC), are accelerating demand for fast access to large amounts of data. To support this growing demand, the next generation of PCI Express, PCIe 6.0, will use multi-level signalling (PAM4) to double data transfer speeds from the 32 gigatransfers/s (GT/s) provided by PCIe 5.0. While this helps satisfy the need for fast data access, the new multi-level signalling approach will create significant new test complexities for system developers.
Teledyne LeCroy’s new QPHY-PCIE6-TX-RX fully automated test software, and the SDAIII-PCIE6 and SDAIII-PAMx characterisation and debug software packages, when used together with a Teledyne LeCroy LabMaster 10 Zi-A oscilloscope and SDAIII-CompleteLinQ serial data analysis software, provide PCIe developers with the tools they need to test and debug complex PCIe 6.0 devices.
This new solution can:
• Calculate and display jitter in three, unique transition groupings.
• Measure transmitter equalisation (Tx EQ) settings, with results and methodologies aligned with current SigTest AC fit methods.
• Provide customisable setups for measuring pre-set cursors and waveforms using unique transmitter equalisation tools.
• Measure Signal-to-Noise-and-Distortion Ratio (SNDR) with robust oscilloscope noise compensation and powerful signal analysis waveform views.
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