STMicroelectronics has an ecosystem for machine learning (ML) in MEMS and sensors, which combines several hardware and software tools to help designers implement gesture and activity recognition with artificial intelligence (AI) at the edge. This is done on sensors through ML algorithms based on decision tree classifiers.
IoT solutions developers can deploy any of ST’s sensors with machine learning core (MLC) in a rapid prototyping environment to quickly develop very low power IoT applications. Thanks to inherently low-power sensor design, advanced AI event detection, wake-up logic, and real-time edge computing, MLC in a sensor reduces processing and data transfer loads on the main system.
ST’s latest generation of sensors with embedded MLC are built in three blocks:
• Sensor data block – The built-in sensors (accelerometer and gyroscope) filter real-time motion data before sending it to the computation block.
• Computation block - Statistical parameters defined as ‘Features’ are applied to the captured data. The features aggregated in the computation block are then used as inputs for the decision tree block.
• Decision tree block – This block evaluates the statistical parameters and compares them against certain thresholds to identify specific situations and generate classified results sent to the MCU.
ST’s MEMS sensors with MLCs offer a wide range of design possibilities for developers by allowing them to create embedded machine learning algorithms and to build the best decision tree for a particular application.
Ultra-low power MEMS accelerometer Altron Arrow
Analogue, Mixed Signal, LSI
Analog Devices’ ADXL366 is an ultra-low power, 3-axis MEMS accelerometer that consumes only 0,96 µA at a 100 Hz output data rate and 191 nA when in motion-triggered wake-up mode.
Read more...ESP32-C6 achieves PSA-L2 iCorp Technologies
DSP, Micros & Memory
Espressif Systems recently announced that its ESP32-C6 microcontroller has achieved PSA Certified Level 2 (PSA-L2) security certification, making it the first RISC-V-based MCU to reach this level.
Read more...Microprocessor with integrated NPU Avnet Silica
DSP, Micros & Memory
The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.
Read more...Dual-core support in NECTO Studio
DSP, Micros & Memory
MIKROE recently announced that version 7.3.0 of its NECTO Studio Integrated Development Environment now supports dual-core MCUs, allowing designers to program and debug each core independently.
Read more...Post Quantum Cryptographic firmware library
DSP, Micros & Memory
The STM32 post-quantum cryptographic library enables developers to satisfy application requirements for any combination of data integrity, confidentiality, identification/authentication, and nonrepudiation.
Read more...Converting high voltages without a transformer Altron Arrow
Editor's Choice Power Electronics / Power Management
With appropriate power converter ICs, such as the LTC7897 from Analog Devices, many applications can be suitably powered without having to use complex and cost-intensive transformers.
Read more...MultiVolt series of oscillators Future Electronics
DSP, Micros & Memory
The ECS-3225MVQ from ECS Inc. is a compact, quartz-based MultiVolt oscillator designed for precision timing in automotive, industrial, and portable electronic systems.
Read more...Drive innovation with AURIX TriCore MCUs Future Electronics
DSP, Micros & Memory
Infineon’s AURIX TriCore family balances safety, performance, and energy efficiency to offer a scalable and future-ready portfolio.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version