Micron has released its HBM3 Gen2 high bandwidth memory to advance generative AI innovation. Generative AI opens a world for new forms of creativity and expression, and unlocks new possibilities for businesses, IT, engineering, science and medicine.
HBM3 Gen2 delivers faster data rates and improved thermal response. The memory has a 50% higher monolithic die density within the same package footprint as the previous generation. With advanced CMOS technology and 1β process technology, Micron’s HBM3 Gen2 provides bandwidth that exceeds 1,2 TB/s. This increase in memory bandwidth improves system-level performance, which reduces training time by more than 30% and allows up to 50% more queries per day.
Micron’s HBM3 Gen2 8-high cube delivers 24 GB of memory with excellent power efficiency for all AI applications.
ESP32-C6 achieves PSA-L2 iCorp Technologies
DSP, Micros & Memory
Espressif Systems recently announced that its ESP32-C6 microcontroller has achieved PSA Certified Level 2 (PSA-L2) security certification, making it the first RISC-V-based MCU to reach this level.
Read more...Microprocessor with integrated NPU Avnet Silica
DSP, Micros & Memory
The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.
Read more...Dual-core support in NECTO Studio
DSP, Micros & Memory
MIKROE recently announced that version 7.3.0 of its NECTO Studio Integrated Development Environment now supports dual-core MCUs, allowing designers to program and debug each core independently.
Read more...Post Quantum Cryptographic firmware library
DSP, Micros & Memory
The STM32 post-quantum cryptographic library enables developers to satisfy application requirements for any combination of data integrity, confidentiality, identification/authentication, and nonrepudiation.
Read more...MultiVolt series of oscillators Future Electronics
DSP, Micros & Memory
The ECS-3225MVQ from ECS Inc. is a compact, quartz-based MultiVolt oscillator designed for precision timing in automotive, industrial, and portable electronic systems.
Read more...Drive innovation with AURIX TriCore MCUs Future Electronics
DSP, Micros & Memory
Infineon’s AURIX TriCore family balances safety, performance, and energy efficiency to offer a scalable and future-ready portfolio.
Read more...Elevate your motor control designs EBV Electrolink
DSP, Micros & Memory
Built on an Arm Cortex-M33 core running up to 180 MHz, the MCX A34 family combines high-performance math acceleration and advanced motor control subsystems to unlock efficient motor drive solutions.
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