Products of the year 2023

22 November 2023 Editor's Choice News

Although many industries had a financially stagnant year after the downward spiral of 2022, the market has started a recovery towards the latter part of this year. That did not deter many players from releasing new and innovative products into the engineering sector.

Again, products are becoming smaller, smarter, and less power hungry. Artificial intelligence (AI) was a dominant theme running through many of the engineering sectors, with most of the design and manufacturing companies incorporating AI and machine learning (ML) into both new products and upgrades. Automotive products saw a leap forward, with new AI capabilities being embedded into ADAS by many SoC manufacturers.

With the state of the power utilities worldwide, renewable energy is another field that is blossoming. New power devices utilising GaN technology are common, and are becoming smaller and more power efficient.

On the wireless front, both 5G and Wi-Fi 6/6E were technologies that found their way into most of the new products. Many new IoT products incorporated these newer wireless systems to improve throughput, while saving power. GNSS systems were also prevalent, with attention being given to new techniques to try to deal with signal spoofing. Open RAN (Open Radio Access Network) saw more vendors coming on board, with its promise of increased competition and innovation while lowering costs.

2023 saw the launch of the first processors and SoC that used 4 and 3 nm processes. This move to smaller dies was critical to further enable increased power efficiency, processing power and data throughput.

Wideband GNSS testing system

New generation of 5G modules

Microcontroller with Bluetooth LE 5.3

Configurable industrial AI computing

Comprehensive AI computing solution

Pure carbide GaN-on-SiC power amplifier

Connectors with extreme density and performance

Power efficient mid-range FPGA

Edge-AI embedded computing

Creating your own Matter ecosystem

Further reading:

From the editor's desk: Is the current AI really what we want?
Technews Publishing Editor's Choice
The companies that develop LLMs need to change direction and concentrate on freeing up our time, not so that we can have more time to do the tasks we don’t want to do in the first place, but rather to allow us more time to do what we love.

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When it comes to long-term reliability of RF amplifier ICs, focus first on die junction temperature
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
When considering the long-term reliability of integrated circuits, a common misconception is that high package or die thermal resistance is problematic. However, high or low thermal resistance, by itself, tells an incomplete story.

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ICs vs modules: Understanding the technical trade-offs for IoT applications
NuVision Electronics Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.

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Why bis means business for LTE Cat 1 IoT connections
NuVision Electronics Editor's Choice Telecoms, Datacoms, Wireless, IoT
Tomaž Petaros, product manager IoT EMEA at Quectel Wireless Solutions explains why the market for Cat 1bis IoT connections is getting busy.

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Interview with Brian Aziz, vice president of global sales, Iridium
Editor's Choice
ridium is the leading satellite IoT player. Their network consists of 66 active low Earth orbit satellites covering every inch of the globe and are used for IoT and emergency services worldwide.

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Accelerating AI adoption in MCU manufacturing
Editor's Choice AI & ML
To gain the value of ML functionality, designers of MCU-based devices have to adopt a new development method and accept a new type of probabilistic rather than deterministic output.

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Altron Arrow: Empowering innovation with STMicroelectronics AI processors
Altron Arrow Editor's Choice AI & ML
ST’s AI processors are not only smarter and faster, but also incredibly efficient, enabling a new wave of intelligent solutions across multiple industries.

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The superpower driving the future of low carbon electricity
Editor's Choice
Modularity is a superpower. The advantage lies in smaller units that can be built, tested, refined, adapted, improved repetitively, allowing many experimentation and learning iterations.

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Eskom’s evolution sparks hope
Editor's Choice
Eskom’s evolution has sparked hope that a large corporation can change and learn to think outside the grid.

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Potential risks of plasma treatment on PCBs
MyKay Tronics Editor's Choice
Plasma treatment involves exposing PCBs to an ionised gas, known as plasma, but despite many advantages, several risks must be managed to ensure safe and effective plasma application in EMS.

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