Products of the year 2023

22 November 2023 Editor's Choice News

Although many industries had a financially stagnant year after the downward spiral of 2022, the market has started a recovery towards the latter part of this year. That did not deter many players from releasing new and innovative products into the engineering sector.

Again, products are becoming smaller, smarter, and less power hungry. Artificial intelligence (AI) was a dominant theme running through many of the engineering sectors, with most of the design and manufacturing companies incorporating AI and machine learning (ML) into both new products and upgrades. Automotive products saw a leap forward, with new AI capabilities being embedded into ADAS by many SoC manufacturers.

With the state of the power utilities worldwide, renewable energy is another field that is blossoming. New power devices utilising GaN technology are common, and are becoming smaller and more power efficient.

On the wireless front, both 5G and Wi-Fi 6/6E were technologies that found their way into most of the new products. Many new IoT products incorporated these newer wireless systems to improve throughput, while saving power. GNSS systems were also prevalent, with attention being given to new techniques to try to deal with signal spoofing. Open RAN (Open Radio Access Network) saw more vendors coming on board, with its promise of increased competition and innovation while lowering costs.

2023 saw the launch of the first processors and SoC that used 4 and 3 nm processes. This move to smaller dies was critical to further enable increased power efficiency, processing power and data throughput.

Wideband GNSS testing system

New generation of 5G modules

Microcontroller with Bluetooth LE 5.3

Configurable industrial AI computing

Comprehensive AI computing solution

Pure carbide GaN-on-SiC power amplifier

Connectors with extreme density and performance

Power efficient mid-range FPGA

Edge-AI embedded computing

Creating your own Matter ecosystem

Further reading:

Quectel’s RG255C-NA and RM255C-GL accelerate 5G RedCap adoption
iCorp Technologies Editor's Choice Telecoms, Datacoms, Wireless, IoT
Quectel’s RG255C-NA and RM255C-GL modules represent a strategic move into this fast-growing segment, delivering Sub-6 GHz 5G connectivity optimised for mid-tier IoT applications.

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SDRs – Which RF architecture should you choose?
RFiber Solutions Editor's Choice Telecoms, Datacoms, Wireless, IoT
There are several common methods of implementing SDR architectures. This paper discusses which is best when meeting a specific need.

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Surviving the extremes: Understanding shock and vibration in MEMS sensors
Altron Arrow Editor's Choice Test & Measurement
By considering factors such as mechanical headroom, damping, and system-level robustness, designers can ensure that the chosen sensor not only survives, but performs reliably over time.

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A two-stage approach to super-wide input voltage range DC-DC converters
RFiber Solutions Editor's Choice
Teaser: In addition to handling the various input voltage ranges required, the SynQor line of InQor DC-DC converters are fully encased and ruggedised to handle the harsh environments that often accompany systems that have such challenging technical requirements.

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From the editor's desk: Engineering the future
Technews Publishing Editor's Choice
As we welcome the first issue of Dataweek in a new year, it is an exciting time to be part of the electronics community, especially for our readers. The pace of change across our industry continues to accelerate, reshaping how we design, build, and interact with technology.

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Barracuda commissions new IPC Class 3 aerospace facility
Barracuda Holdings Editor's Choice News
The company has commissioned a new dedicated IPC Class 3 facility in Somerset West. and has concluded a new investment partnership that will provide the capital and management capacity required to scale operations.

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Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

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Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

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From the editor's desk: Could X-ray lithography disrupt the economics of advanced chip manufacturing?
Technews Publishing Editor's Choice
Advanced semiconductor manufacturing has reached a point where technical progress is increasingly constrained by economic reality, and the proposed use of X-ray lithography represents a bold attempt to reset these economics.

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Could the EU’s Cyber Resilience Act affect your electronics manufacturing business?
Altron Arrow Editor's Choice
South African companies exporting IoT devices to the European Union face a significant regulatory shift with the Cyber Resilience Act becoming mandatory in December 2027.

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