DSP, Micros & Memory


i.MX RT700 for the AI-enabled edge

31 October 2024 DSP, Micros & Memory

NXP Semiconductors has announced its new i.MX RT700 crossover MCU family, designed to power smart AI-enabled edge devices, such as wearables, consumer medical devices, smart home devices and HMI platforms. The i.MX RT700 family delivers an optimised combination of high performance, extensive integration, advanced functionality, and power efficiency for the new era of edge AI computing.

Featuring up to five powerful cores in a single device, the i.MX RT700 includes the first instantiation of the eIQ Neutron NPU in a crossover MCU, accelerating AI workloads by up to 172x, while simultaneously reducing energy per inference by up to 119x.

The i.MX RT700 crossover MCUs also integrate up to 7,5 MB ultra-low power SRAM and offer a 30-70% reduction in power consumption compared to previous generations.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

High performance SDR design considerations
RFiber Solutions Editor's Choice DSP, Micros & Memory
As the spectrum gets increasingly crowded, and adversaries more capable, the task of examining wide bands and making sense of it all, while not missing anything, gets harder.

Read more...
Direct RF converters and FPGAs boost EW applications
RFiber Solutions DSP, Micros & Memory
The latest boost to electronic warfare designs comes from emerging FPGA architectures that combine advanced RF converters and high-performance processing engines in a single package.

Read more...
1-Wire EEPROM with secure authenticator
Altron Arrow DSP, Micros & Memory
The DS28E54 secure authenticator combines FIPS 202-compliant secure hash algorithm (SHA-3) challenge and response authentication with secured electrically erasable programmable read-only memory.

Read more...
New SiC power MOSFET
Future Electronics Power Electronics / Power Management
STMicroelectronics’ SCT012H90G3AG is a robust, automotive-grade SiC MOSFET, engineered for demanding power electronics, featuring a 900?V drain-source voltage and exceptionally low on-resistance of 12?mO at 60?A.

Read more...
Satellite IoT through non-terrestrial networks
Future Electronics Editor's Choice Telecoms, Datacoms, Wireless, IoT
Non-terrestrial networks fill cellular coverage gaps in remote areas by extending terrestrial networks and are not subject to disruptions from natural disasters or sabotage.

Read more...
1D Time-of-Flight sensor
Future Electronics Telecoms, Datacoms, Wireless, IoT
ams OSRAM has introduced its TMF8806, a 1D Time-of-Flight sensor that has been developed to remove the barriers of previous single-zone dToF devices.

Read more...
Easy installation panel mount assembly
Future Electronics Enclosures, Racks, Cabinets & Panel Products
NKK’s new easy installation Panel Mount Assembly (the BYB201-470) consists of a PCB, resistor, connector, and a straight PC adaptor.

Read more...
Microchip enhances digital signal controller lineup
Future Electronics DSP, Micros & Memory
Microchip Technology has added the dsPIC33AK512MPS512 and dsPIC33AK512MC510 Digital Signal Controller families to its dsPIC33A DSC product line.

Read more...
MCX C Series development board
Avnet Silica DSP, Micros & Memory
The FRDM-MCXC444 is a compact and scalable development board for rapid prototyping of MCX C444 MCU from NXP Semiconductors.

Read more...
Redefining entry-level MCUs
NuVision Electronics DSP, Micros & Memory
The company positions the GD32C231 series as a ‘high-performance entry-level’ solution designed to offer more competitive options for multiple applications.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved