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Categories
Editor's Choice
Multimedia, Videos
AI & ML
Analogue, Mixed Signal, LSI
Circuit & System Protection
Computer/Embedded Technology
Design Automation
DSP, Micros & Memory
Edge Computing & IIoT
Electronics Technology
Enclosures, Racks, Cabinets & Panel Products
Events
Interconnection
Manufacturing / Production Technology, Hardware & Services
News
Opto-Electronics
Passive Components
Power Electronics / Power Management
Programmable Logic
Smart Home Automation
Switches, Relays & Keypads
Telecoms, Datacoms, Wireless, IoT
Test & Measurement
PDF
e-Book
31 October 2024
EBG — Electronics Buyers' Guide
Featured articles
5G RedCap and its current environment
Eight ways temporary solder mask is used for electronic assembly
From humble beginnings to industry excellence
How ADI battery management solutions empower safer, smarter robots
New element reduces power consumption of AI
SBC with Intel N-series processor
Events
EVENTS
News
From the editor's desk: A brave new world
IO Ninja debugging tool
Price hike to challenge energy reforms
Young SA robotics team takes world title
2025 outlook for DRAM is poor
Trina Storage ranked in top 10
AI & ML
A perfect match for next-gen computing
AAEON introduces Amston Lake to processor options
High-performance low SWaP SDR
Protecting rhinos with a tech shield
Analogue, Mixed Signal, LSI
16-bit voltage output denseDAC
Circuit & System Protection
Clearing the Static: Three steps for a dry ESD packaging system
DSP, Micros & Memory
i.MX RT700 for the AI-enabled edge
New embedded software development environment
PCIe NVMe SSDs for Cloud and Hyperscale environments
32-bit range of MCUs
Development kit for programmable 16-channel low-side driver
MediaTek’s new SoC offers extreme performance
Microchip’s RTG4 FPGAs achieve highest space qualification
New VelocityDRIVE Software Platform
Enclosures, Racks, Cabinets & Panel Products
DC to 40 GHz termination
Interconnection
High-density coax assemblies
Versatile high-current contacts
Manufacturing / Production Technology, Hardware & Services
MIRTEC to enhance AOI machines with Siemens’ Valor Process Preparation software
PCBWay: Your one-stop shop for electronics manufacturing from design to production
Webinar: End-to-end ML model development
Webinar: Rapidly create vision-based edge AI solutions
An approach to modernising manufacturing operations
Autonomous labour-saving factory solution
Easy-PC celebrates 40 years in PCB design
Intelligent pick-and-place productivity
Newest mounter designed for the autonomous factory
Simple and intelligent assembly
Smart AOI provides essential inspection
The next generation of reflow oven
Yamaha accelerates transition to next-gen vehicle lighting
Opto-Electronics
HTML5 WebPanel with Linux, Android, or AutomationBrowser
Laser control for smart glasses
New optical sensors for object detection
PVision introduces interactive PoS to South Africa
Passive Components
Moulded inductors
New components from KEMET available from TME
Advanced high-voltage capacitors
Chip capacitors for high-voltage applications
Power Electronics / Power Management
Highest density automotive-grade power modules
Industrial power supply range
MOSFET for automotive applications
PSUs for industrial applications
Three-phase inverter reference design
Telecoms, Datacoms, Wireless, IoT
Multi-band satellite modules
Open-source flexibility for IoT gateway
Quectel adds to its portfolio
Three new short-range radio modules
NTN comms module enables IoT deployment anywhere
Two-stage linear RF power amplifier
Test & Measurement
QA introduces large chisel tip style probes
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