AI & ML

• How AI is transforming software engineering

• Quantum computing explained

Circuit & System Protection

• Clearing the Static: ESD component safety in storage and transportation

Computer/Embedded Technology

• Eskom announces PV registration extension

• QuecPi smart development board

DSP, Micros & Memory

• 32 Mbit SRAM chip
• Integrated STM32WBA6 wireless microcontrollers
• Low-jitter oscillators

• PolarFire SoC FPGAs achieve AEC-Q100 qualification
• Raspberry Pi 5 SBC
• The world’s first RISC-V MCU to achieve PSA-L2
• Ultra-low-power MCU with FPU Arm Cortex-M33

Enclosures, Racks, Cabinets & Panel Products

• RF shield box to 12 GHz

Events

• Tech Talks – Enabling AI/ML at the edge

Interconnection

• Connectors for energy storage systems
• New connector for Push-X technology

• Safe connection under load
• Test cable designed for maximum ruggedness
• Time-To-Market interconnect solutions

Passive Components

• Compact EMI suppression capacitors
• Film and mica capacitors
• Large capacitance MLCCs at 100 V

• Power inductors
• Power-over-coax inductors
• SMT power inductors
• Thick film power resistors

Power Electronics / Power Management

• BYD introduces new energy storage solutions
• DC converter for Hi-Rel applications

• Distributed Energy Resource Management Systems
• High-voltage IGBT
• Micro energy harvesting

Switches, Relays & Keypads

• Stainless steel panel switch

• Tuning knobs in modern designs

Telecoms, Datacoms, Wireless, IoT

• 2500 W GaN on SiC amplifier
• Bluetooth module brilliance
• Boost your LTE/5G signal
• Compact and powerful Bluetooth module

• High-accuracy positioning
• High-power radar band amplifier
• LTE Cat 1 modules offer next-gen connectivity
• NXP’s latest wireless chip solution
• STM releases innovative GNSS receiver

Test & Measurement

• Telemetry retrofit for sustainable resource management