STMicroelectronics has released a reference design for a 45 W USB Type-C power supply which has an output from 5 to 20 V DC.
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STMicroelectronics has announced an advanced inertial module with intelligent on-chip functionalities for high-end applications, including UI support.
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STMicroelectronics and Soitec have announced the next stage of the cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.
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The REF35 is a family of nano-power, low-drift, high-precision series reference devices which features ±0,05% initial accuracy and 650 nA typical power consumption.
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AAEON has released its newest and most sophisticated addition to the rackmount network application range. The FWS-7541, powered by an Intel Xeon D-1700 processor, offers Xeon-level performance while maintaining an efficient use of power.
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The TPS25985x from Texas Instruments is a 4,5 to 16 V, 0,59 mO, 80 A stackable compact eFuse with an accurate current monitor.
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Infineon’s first completely autonomous 60 GHz radar sensor MMIC, the BGT60LTR11AIP, is a fully integrated microwave motion sensor including Antennas in Package (AIP) and integrated detectors for motion and direction of motion.
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Radar is a powerful, cost-effective replacement for conventional PIR sensors, and Infineon’s Xensiv 60 GHz radar chip is here to revolutionise motion detection.
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In the category of connectivity at the recent 2022 LEAP Awards, the Gold was awarded to Silicon Labs’ BG24 and MG24 families of 2,4 GHz wireless SoCs.
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During CES 2023, Infineon will be providing an exclusive preview of the latest technologies that enable intelligent and secure IoT solutions for a sustainable future.
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Matter is an automation connectivity standard that has been designed with the main purpose of reducing fragmentation across IoT products from different vendors, and this will transform the automation landscape by achieving interoperability among smart home platforms.
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Prototyping RF designs with the X-Microwave modular system can dramatically reduce the time and resources needed to test an RF signal chain by enabling clean, modifiable, near-PCB prototypes through 60 GHz to be built and tested in a single afternoon.
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