Tel: | +27 11 458 9000 |
Email: | [email protected] |
www: | www.electrocomp.co.za |
more information about Electrocomp |
The OptiMOS 2-25 V low-voltage MOSFET series is Infineon's response to the increasing requirements in the field of low-voltage power conversion and switching applications. It provides low gate charge,
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Pepi's snap action Model S thermal protector is said to be the thinnest type of control of its kind. Equipped with gold diffused contacts for use in low voltage/low current applications, the bimetallic
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Bourns' Digital product CD catalogue contains full product specification on company's range of protection products. Some include: automotive sensors; chip resistors and arrays; CSP integrated passives;
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Pepi's Models C and CR creep action thermostat/thermal protectors with conductive bimetal construction have low internal resistance and are available with gold diffused contacts for use in low voltage/low
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A snap-action thermal protector suitable for use on 120/240/277 V a.c. loads is available with a variety of bimetallic elements that vary the circuit breaker characteristics of the device. Ideal for use
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Infineon's MultiMediaCards (MMC) are said to be the world's smallest removable solid-state recording media
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At the Embedded World show 2003 in Nuremberg, Infineon Technologies launched its latest microcontroller (MCU) products: a cost-optimised 16-bit microcontroller, and two new members of its 32-bit family
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Infineon's RF bipolar transistors (BFPxx/BFRxx/BFSxx/BFTxx) cover practically the complete range of wired and wireless applications up to a working frequency of 20 GHz. The devices are available in standard
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Bourns' Digital product CD catalogue contains full product specification on company's range of protection products. Some include: automotive sensors; chip resistors and arrays; CSP integrated passives;
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STMicroelectronics has introduced lightning protection IC for telecom equipment in a compact SO-8 package. The SSRP105B1 dual asymmetric transient voltage suppressor helps telecom equipment withstand
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SPICE simulations can model the characteristics of inductive components for lighting with high precision. The electrical parameters of ballasts for fluorescent lamps, for example, can thus
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A semiconductor can generate significant heat during operation, which leads to an increase in the junction temperature. If appropriate measures are not taken to dissipate this heat, the performance of
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