DWFR(dual wall, flame retardant) tubing from TE Connectivity is a highly flame-retardant, high-shrink ratio, adhesive-lined tubing made from a polyolefin jacket with a thermoplastic adhesive inner wall. ...
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As part of its reference design offering called ‘PortNote Solutions’, Bourns has added three new solutions for protecting modern data interfaces, each complemented by a design kit containing the Bourns ...
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Fibocom’s H380 is an HSPA+ module made to the M.2 interface specification for computing expansion cards. Supporting GSM/GPRS/EDGE and UMTS/HSDPA/HSUPA/HSPA+ cellular communications, it can be used to ...
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Historically, the use of a single energy device to satisfy the entire power specification of an application required designers to either design for power (at times providing excess energy) or design for ...
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TE Connectivity’s range of 0,25 mm fine pitch FPC (flexible printed circuit) connectors, available in 37, 41, 45 and 51 positions, were developed to help meet the demand for smaller centreline and lower ...
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Model WS, a new range of wirewound resistors from Bourns, is an axial leaded series designed to withstand higher power surges. The parts are rated from 1 W to 8 W and have a resistance range of 15 Ω ...
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TDK-Lambda has introduced two new series of EPCOS MMKP capacitors which employ a film that is metallised on both sides. They offer particularly high pulse strength as well as high current capability: ...
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AVX released a new radial CapGuard varistor, combining multilayer varistor (MLV) and high-capacitance, temperature-stable X7R multilayer ceramic capacitor (MLCC) technology. Qualified to AEC-Q200, the ...
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TE Connectivity announced its new ALCOSWITCH Subminiature series of switches, adding to the extensive portfolio of 4000 ALCOSWITCH switches for switching power in set-top boxes, control panels, light ...
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Supporting the trend from relay to more robust semiconductor solutions, Infineon Technologies is rolling out its HITFET+ family of protected low-side switches. The HITFET+ range (High Integrated Temperature ...
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New from TDK is a range of ultra-compact EPCOS μDC-DC converters featuring a footprint of only 2,9 x 2,3 mm and an insertion height of 1 mm. The B30000P80* series is designed for an input voltage range ...
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New INSTALITE moulded boots from TE Connectivity are up to 30% lighter than the company’s standard -25 boots. Designed for high-performance applications, such as military ground systems, aerospace and ...
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