Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.
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Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.
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In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.
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Aipu Power has added the RS485-XXXSAV to its transceiver module range, a single-channel isolated RS485 transceiver that bundles power isolation, signal isolation, RS485 interface and bus protection into one drop-in module, aimed at simplifying RS485 network design in industrial equipment.
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SGMICRO continues to add to its analogue IC portfolio at a steady pace, with new devices released across power protection, power conversion, current sensing and RF signal-chain categories.
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Quectel Wireless Solutions has expanded its antenna portfolio with four rugged multi-network combo antennas.
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Quectel Pi series of single-board computers (SBCs), designed for a broad range of industrial applications, include three compact development platforms – the Quectel Pi M1, L1, and H1 boards.
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The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
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As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
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Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.
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Quectel’s FCM266D combines single-band 2,4 GHz Wi-Fi 6 with Bluetooth LE 5.4 in an ultra-compact LCC package measuring just 20 x 18 x 2,4 mm.
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Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.
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