Electrocomp

Tel: +27 11 458 9000
Email: [email protected]
www: www.electrocomp.co.za
more information about Electrocomp

Java-enabled 3G module
10 July 2013, Electrocomp, Telecoms, Datacoms, Wireless, IoT

The flagship Cinterion EHS6 is the 5th generation of Gemalto’s Java embedded machine-to-machine (M2M) modules which have simplified highly efficient, end-to-end industrial communication for the last decade. ...
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3,2” colour displays
10 July 2013, Electrocomp, Opto-Electronics

Topway has developed a family of 3,2” TFT displays featuring QVGA resolution (320 x 240 pixels) and 65k colours. The LCDs can optionally be supplied with an LED backlight driver and a touch panel. They ...
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Low-power LED with overdrive
10 July 2013, Electrocomp, Opto-Electronics

Everlight expanded its range of low-power LEDs with a 0,2 W top-view white LED featuring a lead frame technology with heat slug for good heat dissipation. The new 45-21S series is especially suitable ...
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Card edge connector for LED lighting boards
12 June 2013, Electrocomp, Interconnection

New from TE Connectivity is the Inverted Thru Board (ITB) card edge connector which facilitates direct board-to-board mating of driver boards to the underside of LED array boards. This surface mounted ...
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Connector for solid-state lighting
12 June 2013, Electrocomp, Interconnection

TE Connectivity announced the release of a one-position free hanging plug and receptacle assembly, an extension to the SlimSeal SSL connector family. The low-profile connector was developed for LED lighting ...
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Tri-axis accelerometer
29 May 2013, Electrocomp, Analogue, Mixed Signal, LSI

The KXCJ9 is a low-power, low-noise 3-axis accelerometer with I²C interface, made by Kionix. Featuring a new MEMS sensing element for excellent performance over temperature, in shock test and in reflow, ...
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Gate drivers for solar inverters
29 May 2013, Electrocomp, EBV Electrolink, Power Electronics / Power Management

Infineon's EiceDRIVER portfolio with coreless transformer technology comprises a comprehensive range of high-performance driver ICs for photovoltaic inverters. Infineon combines EiceDRIVER with CoolMOS, ...
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USB host chip and application modules
15 May 2013, Electrocomp, Telecoms, Datacoms, Wireless, IoT

FTDI has released a new USB host IC with Android compatibility, as well as two new application modules supporting its Vinculum-II 16-bit microcontroller with support for USB host and peripheral functionality. The ...
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DC link capacitors
15 May 2013, Electrocomp, Passive Components

TDK has revealed EPCOS CeraLink, an innovative DC link capacitor for frequency converters. It is based on a PLZT ceramic material (lead lanthanum zirconate titanate) and covers a capacitance range from ...
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Fast recovery diodes
15 May 2013, EBV Electrolink, Electrocomp, Power Electronics / Power Management

New from Infineon Technologies are the highly efficient, fast recovery 650 V Rapid 1 and Rapid 2 silicon diode families. Combining Infineon’s ultra-thin wafer manufacturing expertise for a low-loss ...
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High-density SMT headers
15 May 2013, Electrocomp, Interconnection

Molex’s robust family of high-density 1,27 mm wire-to-board Picoflex headers and connectors, now with reverse PCB footprint SMT headers, offers space-saving solutions for a greater range of compact power ...
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High-voltage MOSFETs
1 May 2013, EBV Electrolink, Electrocomp, Power Electronics / Power Management

With the new 650 V CoolMOS CFD2, Infineon has launched the second generation of its high-voltage CoolMOS MOSFET family with integrated fast body diode. The company also marked the occasion of the 3,5 ...
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