Tel: | +27 11 458 9000 |
Email: | [email protected] |
www: | www.electrocomp.co.za |
more information about Electrocomp |
The flagship Cinterion EHS6 is the 5th generation of Gemalto’s Java embedded machine-to-machine (M2M) modules which have simplified highly efficient, end-to-end industrial communication for the last decade.
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Topway has developed a family of 3,2” TFT displays featuring QVGA resolution (320 x 240 pixels) and 65k colours. The LCDs can optionally be supplied with an LED backlight driver and a touch panel. They
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Everlight expanded its range of low-power LEDs with a 0,2 W top-view white LED featuring a lead frame technology with heat slug for good heat dissipation. The new 45-21S series is especially suitable
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New from TE Connectivity is the Inverted Thru Board (ITB) card edge connector which facilitates direct board-to-board mating of driver boards to the underside of LED array boards.
This surface mounted
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TE Connectivity announced the release of a one-position free hanging plug and receptacle assembly, an extension to the SlimSeal SSL connector family.
The low-profile connector was developed for LED lighting
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The KXCJ9 is a low-power, low-noise 3-axis accelerometer with I²C interface, made by Kionix. Featuring a new MEMS sensing element for excellent performance over temperature, in shock test and in reflow,
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Infineon's EiceDRIVER portfolio with coreless transformer technology comprises a comprehensive range of high-performance driver ICs for photovoltaic inverters. Infineon combines EiceDRIVER with CoolMOS,
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FTDI has released a new USB host IC with Android compatibility, as well as two new application modules supporting its Vinculum-II 16-bit microcontroller with support for USB host and peripheral functionality.
The
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TDK has revealed EPCOS CeraLink, an innovative DC link capacitor for frequency converters. It is based on a PLZT ceramic material (lead lanthanum zirconate titanate) and covers a capacitance range from
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New from Infineon Technologies are the highly efficient, fast recovery 650 V Rapid 1 and Rapid 2 silicon diode families.
Combining Infineon’s ultra-thin wafer manufacturing expertise for a low-loss
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Molex’s robust family of high-density 1,27 mm wire-to-board Picoflex headers and connectors, now with reverse PCB footprint SMT headers, offers space-saving solutions for a greater range of compact power
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With the new 650 V CoolMOS CFD2, Infineon has launched the second generation of its high-voltage CoolMOS MOSFET family with integrated fast body diode.
The company also marked the occasion of the 3,5
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