Electrocomp

Tel: +27 11 458 9000
Email: [email protected]
www: www.electrocomp.co.za
more information about Electrocomp

USB 2.0 to serial UART converters
7 July 2010, Electrocomp, MB Silicon Systems, Interconnection

FTDI has released the TTL-232RG family of USB to TTL serial UART converter cables. The cables build upon the existing FTDI family of USB to TTL cables by offering new versions to support an extended variety ...
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Electrocomp Express supports Farnell range
23 June 2010, Electrocomp, News

The new Electrocomp Express entity will be dedicated to supporting the Farnell agency, the world’s largest catalogue supplier.
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Miniaturised GPS module
9 June 2010, Electrocomp, Telecoms, Datacoms, Wireless, IoT

Fastrax has introduced the Fastrax IT520, the smallest GPS receiver in Fastrax’s IT500 series of GPS modules. The IT520 features a form factor of only 10,4 x 14,0 x 2,3 mm, allowing for easy utilisation ...
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USB 2.0 module replaces DB9 RS232 connectors
9 June 2010, Electrocomp, Interconnection

New from FTDI is the DB9-USB-RS232 range of modules, designed to replace a DB9-based RS232 connector, on an existing board design, with a USB 2.0 connector interface. The modules feature a standard USB ...
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USB 2.0 host/slave development aids
12 May 2010, Electrocomp, MB Silicon Systems, Design Automation

FTDI has launched a range of VNC2 evaluation modules (V2DIP-x), a VNC2 evaluation kit (V2-EVAL) and a VNC2 debug module. These modules are designed to help designers quickly develop embedded USB 2.0 host/slave ...
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Multilayer ceramic coils
12 May 2010, Electrocomp, Passive Components

TDK-EPC has developed the new MLG0402Q series of multilayer ceramic coils in 0402 with a Q factor of 15,8 at 1 GHz and 10  nH. They are chip components with a compact 0402 size (0,4 × 0,2 × 0,2 mm). Their ...
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IGBT sixpack with shunts
12 May 2010, Electrocomp, EBV Electrolink, Power Electronics / Power Management

Infineon’s MIPAQ base development unites the latest IGBT technology with internal sensors for accurate current sensing in the well-established EconoPACK 3 package. The 1200 V, 75–150 A solution is targeted ...
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Common-mode filter with ESD suppression
28 April 2010, Electrocomp, Circuit & System Protection

TDK-EPC has introduced a thin-film common-mode filter with both high-speed differential transmission common-mode noise suppression and ESD protection. The TCE1210 is the same size as existing TDK common-mode ...
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Pulse transformers for LAN applications
28 April 2010, Electrocomp, Passive Components

TDK-EPC has developed a series of pulse transformers in SMD design for LAN use. With an inductance of at least 200 μH and an insertion loss of not more than 1,5 dB, the design of the new ALT4532-001T ...
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Programmable USB 2.0 host/slave SoC
14 April 2010, MB Silicon Systems, Electrocomp, Telecoms, Datacoms, Wireless, IoT

FTDI recently announced the launch of its Vinculum VNC2 user programmable dual USB 2.0 host/slave intelligent SoC controller. VNC2 enhances the initial member of the Vinculum family, the VNC1L, by reducing ...
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TDK-EPC shrinks MLCCs
14 April 2010, Electrocomp, Passive Components

TDK-EPC has released a new series of multilayer ceramic capacitors (MLCC) with C0G temperature characteristics and a rated voltage of 50 V. The new parts are 60% or one size smaller than existing products ...
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Driver for 0,5 W LEDs
14 April 2010, Electrocomp, EBV Electrolink, Opto-Electronics

The BCR 320U/BCR 420U LED driver family from Infineon is a low-cost solution for driving 0,5 W LEDs with currents from 150 mA to 250 mA. Their internal breakdown voltage is 20 V (BCR 320U) and 40 V (BCR ...
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