Future Electronics

Tel: +27 21 421 8292
Email: marian.ledgerwood@futureelectronics.com
www: www.futureelectronics.com
more information about Future Electronics

SMT power inductors
30 April 2025, Passive Components

The Würth Elektronik WE-MXGI SMT power inductors are the latest addition to Würth Elektronik’s moulded power inductor series, engineered for high-frequency power applications.
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USB Type-C-powered controllers
28 March 2025, Power Electronics / Power Management

Diodes Incorporated has released two USB Type-C PD 3.1 extended power range sink controllers that can be embedded into battery-powered devices.
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SoC for real-time AI at the edge
28 March 2025, DSP, Micros & Memory

Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.
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Evaluation kit for ML applications
28 March 2025, DSP, Micros & Memory

The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.
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Power relays for energy management applications
28 February 2025, Power Electronics / Power Management

The Panasonic Industry HE-R Series is an energy management relay designed for single-phase or 3-phase AC charging units, combining high capacity, high switching, and low operating power into a small size power relay.
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Advanced eMMC storage solutions
28 February 2025, DSP, Micros & Memory

Alliance Memory provides advanced NAND flash memory storage solutions that follow the JEDEC eMMC v5.1 standard to meet the growing demand for efficient, high-capacity storage solutions in today’s digital era.
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NPU in the most powerful STM32 processor
28 February 2025, DSP, Micros & Memory

The STM32N6 is STMicroelectronics’ newest and most powerful STM32 and the first to come with the company’s Neural-ART Accelerator, a custom NPU capable of 600 GOPS.
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E-mobility innovation: balancing power, sensors, and connectivity
EMP 2025 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services

The future of e-mobility is being shaped by innovations in power systems, connectivity, and sustainable design, and this article explores key technologies driving the industry forward.
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ST’s biosensing tech enables next-gen wearables
29 November 2024, DSP, Micros & Memory

The highly integrated biosensor device combines an input channel for cardio and neurological sensing, with motion tracking and embedded AI core, for healthcare and fitness applications.
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1700 V GaN Switcher IC
29 November 2024, Power Electronics / Power Management

Power Integrations has introduced a new member of its InnoMux-2 family of single-stage regulated multi-output offline power supply ICs, the industry’s first 1700 V gallium nitride switch.
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32-bit range of MCUs
31 October 2024, DSP, Micros & Memory

If your design has outgrown the capabilities of 8- or 16-bit MCUs, the PIC32 family delivers easy scalability, enhanced performance, and larger memory options.
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Moulded inductors
31 October 2024, Passive Components

Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
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