The new Panasonic ERJPC high precision thick-film resistors series deliver accuracy levels previously only achievable with thin film technology, offering customers higher power density and cost-effective performance.
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congatec has released new COM Express modules with Intel Core Series 3 processors for cost- and energy-optimised embedded computing applications.
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This agreement between Avent Silica and Thales covers the latter’s eSIM solutions that are compliant with GSMA SGP.22 and SGP.32 standards.
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The latest Bluetooth module from Panasonic Industry provides excellent performance and minimal power consumption.
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The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.
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This is a new, RTOS-independent software solution for Bluetooth LE development, designed to ease developers’ migration from the legacy nRF5 SDK and nRF52 series to the next-generation nRF54L series.
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The latest Bluetooth module from Panasonic Industry provides excellent performance and minimal power consumption.
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As reliance on renewable sources like wind and solar continues to grow, the need for efficient energy flow and storage solutions has become more critical than ever.
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The FRDM-MCXC444 is a compact and scalable development board for rapid prototyping of MCX C444 MCU from NXP Semiconductors.
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Panasonic Industry recently announced the launch of the ZVU Series Hybrid Capacitors, a cutting-edge solution tailored to meet the escalating demands of advanced electronic systems.
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To help system architects meet evolving security demands, Microchip Technology has developed its MEC175xB embedded controllers with embedded immutable post-quantum cryptography support.
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Avnet Silica has named Hydronauten winner of the Advanced Electronics Challenge for breakthrough AI-driven vibration damping technology.
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