31 March 2021Manufacturing / Production Technology, Hardware & Services
Build the clearest understanding of electronics defects using top-down 2D, inclined-angle 2.5D, and full 3D X-ray inspection. Ever been to see a doctor for an X-ray and a CT scan? This is a common process that allows medical professionals to build a complete picture for diagnosis.
In the electronics world we have similar X-ray techniques for non-destructive failure analysis. A quick 2D X-ray inspection provides a good insight into signs of defective connections, and a 3D CT scan can verify the problem with the added benefits of more data, building the complete picture ready for diagnosis.
BGA (ball grid array) packages are commonly inspected non-destructively utilising X-rays. Each solder joint is an individual electrical connection. A good solder joint will be reasonably circular in shape and the size of the joints should be reasonably consistent throughout the device array.
Figure 2. Ball diameter measurements performed on a BGA device.
Figure 1 shows several different types of defects which may occur during the BGA assembly reflow process. 2D X-ray inspection is a great tool for quick analysis, and one type of analysis that can easily be performed is a ball diameter measurement (Figure 2). Here one can see that the ball on the bottom right is approximately 70 µm smaller in size than its neighbouring joints. This is the first sign that there is a potential problem with this connection.
Figure 3 is a 2.5D oblique-angle image of theses joints. This image builds our diagnosis further, as now we see another sign that this joint is not completely fused on one side. This is seen through a different greyscale displayed on the interface of this joint.
Having identified strong signs that there is potentially a defective connection, this can be verified further with a 3D CT scan. CT is a technique which captures several images from different angles and then uses reconstruction algorithms to create a 3D model. The results of this can be seen in Figure 4.
Figure 3. 2.5D oblique-angle view of the BGA solder joints.
It can clearly be seen that there is a difference in the ball shape highlighted with red arrows compared with surrounding balls. The image to the top right side shows the quality of ball wetting to the device interface. It is clearly seen that there is an interfacial difference compared to neighbouring joints.
Now that both 2D and 3D images have been analysed, there is enough data to build a complete picture and diagnose this BGA device. The solder joint is confirmed as ‘non-wet open’ and as a result this would have significant impact on its integrity, and ultimately the integrity of the BGA device and the product it ends up in.
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Figure 1. A range of defects that can occur during the BGA reflow process.
Figure 4. Multiple 3D rendered views of the BGA device.
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