Is it estimated that by 2026, more than 25 billion IoT devices will be wirelessly connected worldwide. Applications of these connected devices range from simple temperature sensors to advanced wearables such as smartwatches and augmented reality glasses.
Testing IoT applications brings new challenges. Firstly, the circuits are becoming increasingly smaller, which frequently results in fewer test points on the circuit boards due to space limitations. Secondly, growing numbers of units must be tested in parallel production lines reliably and, above all, free from interference. To avoid cross interference of the DUTs during parallel test operation, they must be shielded from the environment. This is achieved using shielding chambers that have additional absorber material inside (so-called absorber chambers) to avoid multiple path reflection within the chamber.
With the manual test fixtures from the MA 21xx and 32xx series as well as the radio frequency exchangeable kits (HF-ATS), Ingun offers a unique modular system which allows the shielding chamber to be selected according to the size of the DUT and to be customised to that specific design. For radio frequency testing via an over-the-air (OTA) interface, optionally available absorber material can be selected in accordance with the frequency band used in the application.
In addition, radio frequency interfaces ensure a connection from inside the shielding chamber to the test system without interference: solutions for coaxial connection, or with an additional filter for digital signals such as USB and Ethernet LAN are available.
Modularity is also key. In the event of a revision of the DUT that requires a new design of the DUT-specific customisation or even a new product, e.g., for a different frequency band, a new exchangeable kit can be used. The basic unit with the closing and opening mechanism, as well as all electrical connections to the test system can be reused without any further intervention, saving on time and preventing error-prone conversions.
Wireless connectivity expanded iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.
Read more...Integrated X-band radar front-end module RF Design
Telecoms, Datacoms, Wireless, IoT
Qorvo has introduced an X-band radar front-end solution that enables defence system designers to achieve higher performance without increasing size, weight or prime power.
Read more...Introducing Aurata CST Electronics
Telecoms, Datacoms, Wireless, IoT
Antenova has launched Aurata SR4L112: a compact, high efficiency embedded 4G/LTE antenna engineered for long, narrow PCB designs.
Read more...Multi-constellation GNSS module in a legacy-compatible footprint Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
Read more...Quectel expands 5G portfolio iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.
Read more...Compact RTK design: More than just the receiver iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.
Read more...Microchip advances Space-Grade timing performance ASIC Design Services
Telecoms, Datacoms, Wireless, IoT
Microchip Technology has expanded its atomic clock portfolio with the radiation-tolerant Space CSAC-SA65, a Chip Scale Atomic Clock designed to deliver precise timing for space systems.
Read more...Channel emulator for 6 G and Wi-Fi 7/8 Concilium Technologies
Telecoms, Datacoms, Wireless, IoT
With 400 MHz instantaneous bandwidth and support for carrier frequencies up to 23,6 GHz, Vertex 6.0 is the industry’s first channel emulator designed for next generation 6 G and Wi-Fi 7/8 testing.
Read more...Secure, low-power Bluetooth LE SoC NuVision Electronics
Telecoms, Datacoms, Wireless, IoT
Silicon Labs unveils BG2B, its lowest-power Bluetooth LE SoC with industry-leading power efficiency, security, and integration.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version