With the continuous development of AI technology, the demand for computing power in data centres is rapidly increasing, which forces the AI servers and other computing equipment to demand higher power.
Due to the application of AI acceleration cards, the height of devices is more limited. This has resulted in the emergence of multi-phase,
ultra-high current copper magnetic co-fired power inductors.
These power inductors, HTF-MP, play an important role in the power supply system composed of multi-phase controllers and DrMOS. They can regulate voltage through nonlinear control, multi-phase interleaved parallel connection, and other technologies to meet the power supply needs of GPU and HBM3 modules. Therefore, HTF-MP can be used extensively in the key application stage of GPU power supply conversion of 12 V down to 0,8 - 1,3 V.
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications. Compared with the single-phase HTF-H series, the HTF-MP series is more suitable for complex multiphase power supply applications in design,
effectively meeting the needs of ultra-thin and high-power devices, such as high-performance computing platforms and low-profile electronic devices.
Thanks to its innovative structural design, the HTF-MP series inductor has various unique and powerful advantages:
• Compared with assembled inductors, it has no acoustic noise, a lower EMI, and lower losses.
• Compared with traditional moulded inductors, it has higher magnetic permeability and better DC resistance.
• Compared with HTF-H inductors, it has higher integration and saves more space on the design of the PCB.
Harnessing Leakage Inductance Würth Electronics South Africa
Passive Components
Würth Electronics has expanded its WE-MCRI product series with the new 1090HL variant (HL = High Leakage), a coupled inductor specifically designed to improve the performance of SEPIC, ZETA and Cuk converters.
Read more...Wireless connectivity expanded iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.
Read more...Space saving SMD common-mode chokes Electrocomp
Passive Components
TDK Corporation presents the EP21 series of flat-wire double chokes designed for common-mode EMI filtering and available in an SMD format with dimensions of only 23,8 x 17,7 mm and heights ranging from 21,6 to 22,3 mm
Read more...Highly rugged GAPS and HAPS proximity sensors IOT Electronics
Passive Components
Now available through Powell Electronics are the GAPS (General Aerospace Proximity Sensors) and HAPS (Harsh Application Proximity Sensors) proximity sensors from Honeywell.
Read more...Quectel expands 5G portfolio iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.
Read more...Understanding EMI Filters and their applications Vepac Electronics
Passive Components
Electromagnetic Interference (EMI) Filters are essential for maintaining electromagnetic compatibility (EMC), allowing multiple devices to function together without interference.
Read more...SMT flat-wire inductor
Passive Components
Würth Elektronik introduces its new WE-SFIA series of flat-wire inductors in 2010, 2013, and 2016 packages.
Read more...Compact SSI family for industrial automation Altron Arrow
Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version