DSP, Micros & Memory


Next generation HMI processing platform

28 April 2026 DSP, Micros & Memory

Microchip Technology has expanded its automotive and e-mobility portfolio with the introduction of the AEC Q100 Grade 2 qualified SAM9X75D5M System-in-Package. This hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles. Supporting displays up to 10 inches with XGA resolution of 1024 x 768 pixels, the SAM9X75D5M provides the performance headroom needed for feature rich digital cockpits and advanced graphical interfaces.

As part of Microchip’s hybrid MCU family, the SAM9X75D5M allows designers to benefit from microprocessor class processing, while maintaining the familiar workflow of traditional MCU based development. It supports popular RTOSs and is ideal for automotive applications such as digital clusters, HVAC control systems, EV chargers, and smart instrument clusters. By combining the MPU and DDR2 memory into a single compact package, the SiP reduces PCB routing complexity, improves reliability, and simplifies system design.

The integrated DDR2 memory also mitigates the supply chain volatility commonly associated with discrete DRAM. Designers gain more predictable component availability, reduced procurement risk, and a streamlined bill of materials. This hybrid architecture provides a practical migration path for developers moving from MCUs to higher performance MPUs as graphical and memory demands continue to rise.

The SAM9X75D5M supports MIPI DSI, LVDS, and parallel RGB display interfaces, offering significant flexibility for display driven applications. Additional features include CAN FD, USB, Gigabit Ethernet with TSN support, integrated 2D graphics, and audio capabilities.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Cost-effective microcontroller series
Altron Arrow DSP, Micros & Memory
The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.

Read more...
Battery-friendly Thread and BLE solution
iCorp Technologies DSP, Micros & Memory
Positioned as an incremental upgrade to the ESP32-H2, Espressif’s ESP32-H21 adds an integrated DC-DC converter that reduces active current draw and helps extend battery life in power-sensitive consumer and industrial devices.

Read more...
MIL-spec connector series
Future Electronics Interconnection
The MIL-HD2 connector series from Amphenol is the company’s next-generation, SOSA-aligned solution engineered to meet the most demanding requirements of modern military embedded systems.

Read more...
Next-generation HMI and vision processing
Future Electronics Edge Computing & IIoT
The Renesas RA8D2 group of microcontrollers delivers ultra-high performance for next-generation graphics, HMI, and vision-driven designs that demand fast response, rich visual interfaces, and embedded AI capability.

Read more...
Low-power SoC for IoT designs
iCorp Technologies DSP, Micros & Memory
Espressif’s ESP32-H4 is a dual-core 32-bit RISC-V SoC designed for battery-powered wireless products that require low energy consumption, strong security, and modern connectivity.

Read more...
Chip for high-density power
Future Electronics DSP, Micros & Memory
Microchip’s dsPIC33AK256MPS306 Digital Signal Controllers combine high-resolution control, high-speed analogue, and security with support for post-quantum cryptography.

Read more...
The end of ‘entry-level’: STMicroelectronics’ STM32C5 sets a new baseline for embedded systems
DSP, Micros & Memory
[Sponsored] Instead of incrementally improving legacy Cortex-M0+ architectures, STM32C5 introduces a Cortex-M33-based platform into the entry-level category. This changes not only performance expectations, but also how engineers approach system architecture, consolidation, and long-term scalability.

Read more...
GigaDevice expands GD25UF Series density
NuVision Electronics DSP, Micros & Memory
GigaDevice has announced the expanded density range of its GD25UF series 1,2 V ultra-low power SPI NOR Flash, now spanning from 8 Mb to 256 Mb.

Read more...
ARINC 429 line driver evaluation board
ASIC Design Services DSP, Micros & Memory
Holt Integrated Circuits have announced the release of the ADK-85104 Evaluation Board, a compact, ready-to-use platform designed to help engineers rapidly evaluate and characterise Holt’s HI-85104.

Read more...
Highly integrated 24-channel mixed signal IC
EBV Electrolink DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved