Telecoms, Datacoms, Wireless, IoT


GigaDevice expands optical communication portfolio

29 June 2026 Telecoms, Datacoms, Wireless, IoT

To further support the advancement of high-speed optical interconnect technologies and expand its optical communication product portfolio, GigaDevice has introduced the new GD32E512 and GD32E252 series MCUs specifically designed for optical module applications. The new products extend GigaDevice’s optical communication MCU portfolio, addressing the diverse requirements of both high-speed and low-speed optical modules, while providing highly integrated and application-optimised solutions.

GD32E512 series

Targeting the demanding requirements of high-speed optical modules, the GD32E512 series features a high-performance Arm Cortex-M33 core operating at up to 120 MHz. The series introduces integrated I3C support, enabling high-bandwidth, low-latency, and high-density communication to meet the evolving requirements of next-generation optical modules.

The GD32E512 series is available in an ultra-compact 3 x 3 mm package, helping customers optimise PCB space and support the ongoing trend toward higher integration and miniaturisation in optical module designs.

To further simplify system design, the GD32E512 series integrates a rich set of application-oriented peripherals, including 3x I2C, 1x MDIO, 2x ADC, 4x DAC, 2x comparators, and 2x operational amplifiers, providing comprehensive monitoring, control, and management capabilities for high-speed optical module applications.

GD32E252 series

The GD32E252 series is specifically designed for low-speed optical module applications and is built around the Arm Cortex-M23 core. Through continuous optimisation, the series delivers enhanced analogue performance, while maintaining a high level of integration, low power consumption, and reliable operation.

Designed to address the requirements of access networks, industrial optical communications, and other cost-sensitive optical connectivity applications, the GD32E252 series provides an optimised balance of performance, integration, and efficiency. The devices also feature compact package options, wide-temperature operation, and strong EMC performance, helping customers simplify system design, reduce development complexity, and accelerate time-to-market.


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