Quectel has launched new modules on two different chipset platforms: The RG660QA and RG660QB are built on Qualcomm’s X85 and X82 5G Modem-RF systems respectively. Paired with dedicated co-processors, the pair can deliver up to 24 TOPS of on-device compute for edge AI workloads. Multi-antenna reception is configured up to DL 8Rx on the RG660QA and DL 6Rx on the RG660QB, with improved uplink throughput on both, aimed at higher data throughput, better signal quality and more reliable connectivity in challenging network environments or high-mobility scenarios.
Quectel and UNISOC jointly unveiled a new 5G module matrix spanning three platforms: the 5G eMBB V620, the 5G eMBB V610, and the 5G RedCap V527, a further step toward large-scale 5G IoT deployment.
The flagship of the new matrix, the RG620UA and RM520UA, is built on the V620 platform and pairs a quad-core A55 processor with rich Ethernet configurations and Wi-Fi 7/Wi-Fi 6 connectivity, aimed at applications that need both wired and wireless flexibility alongside strong 5G data rates.
For more space-constrained designs, the RG258UB-GL and RG258UB-CN are compact 5G modules built on the V610 platform, aimed at global portable terminals and power IoT applications.
Between the Qualcomm-based RG660Q series and the UNISOC-based V620/V610/V527 matrix, Quectel’s 5G line-up now spans a considerably wider band, from edge-AI-capability, high-throughput modules for hotspots and premium CPE, through to compact, cost-optimised modules for portable and power-constrained IoT devices, with RedCap covering the mid-tier in between.
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