Manufacturing / Production Technology, Hardware & Services


Solder paste boasting temperature stability

4 November 2015 Manufacturing / Production Technology, Hardware & Services

Since Henkel débuted the industry’s first ever temperature-stable solder paste earlier this year, the company says more than 1000 sample requests of the material have been fulfilled and customers who have qualified it are singing its praises.

Matt Polak, owner of Raven Systems Design, describes his experience with Loctite GC 10. “We have always had issues with paste drying out prematurely and clogging fine-pitch apertures, even during the course of a daily production run,” he explains. “Because of the fine-pitch, high-density nature and the reliability requirements of the products we are producing, re-using paste has always been out of the question and we expect to discard a minimum of one third of the unused paste of every jar we open.

“Loctite GC 10 has completely changed our traditional working models. The paste has given us nothing but perfect, consistent results with no refrigeration. In our evaluation, Loctite GC 10 came out of the jar perfect and the printing results at 60 hours were just as good as they were an hour after opening the jar. It printed and reflowed flawlessly and we achieved very close to 100% yield. In addition, we didn’t experience any aperture clogging, the stencil cleaned up easily and the paste didn’t dry out. The cost savings for our business are substantial and far outweigh any incremental cost differential versus competitive pastes. Loctite GC 10 is absolutely the ‘game changer’ it claims to be.”

Temperature stable at 26,5°C for one year and stable at temperatures of up to 40°C for one month, this paste overcomes the processing and performance challenges experienced by conventional solder paste products. Whereas traditional materials have abandon times ranging from 1 to 4 hours on average, Loctite GC 10 has abandon times of up to 24 hours, a stencil life of up to 72 hours and zero startup time. The formulation of the material delivers stabilised and consistent print transfer efficiency, an expanded reflow window and increased activity for better results with soak temperatures between 150°C and 200°C.

Transportation costs can also be reduced and energy consumption at the facility decreased, since the temperature stability of the material eliminates the requirement for cold packing and overnight shipping and, once at the factory, can be stored at room temperature.



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