13 July 2016Manufacturing / Production Technology, Hardware & Services
The X-ray inspection system X Line 3·D from Göpel Electronic enables reliable inspection of THT and pin-in-paste solder joints in compliance with the IPC quality standard, through a unique combination of 3D X-ray (AXI) and 2D AOI inspection.
That is particularly important for automotive assemblies which are subject to strict quality requirements.
Unlike simple two-dimensional X-ray inspection, 3D X-ray inspection allows evaluation of the solder penetration for THT connectors. Assemblies which are subject to the IPC norm must show a solder penetration of 50 to 75% at the pin, depending on the IPC class. These requirements can be assured through evaluation of the solder penetration layer by layer.
The limits of X-ray technology in this particular application are, however, the requirement of circumferential wetting of pins and the wetted connecting surface (ring). As an example, according to IPC, the circumferential wetting must be proven to be between 270° and 330°. Only the combination of two technologies can provide compliance with this standard. By using a fully integrated and automated AOI module, both circumferential wetting and wetted connecting surface can be evaluated at the solder side.
With the X Line 3·D and the AXOI technology (combined X-ray and optical inspection), maximum fault coverage at line cycle times can be achieved. By scanning image acquisition, time-efficient quality control is made possible. Hole fill levels, pin and pad wetting, bridging and solder balls can be detected with this single system.
The machine is an inspection system for the safe testing of double-sided assembled PCBs. The three-dimensional X-ray inspection covers both top and bottom sides within a continuous process. The basis of this technology is real-time, multi-angle image acquisition, which allows a complete 3D capture of the assembly. Integrated reconstruction methods based on planarGT provide detailed evaluation of the PCB under test, layer by layer.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
Read more...UV curing oven for high-efficiency PCB production Techmet
Manufacturing / Production Technology, Hardware & Services
The jCURE-2UV+ from JTU is a cutting-edge ultraviolet curing oven engineered for fast, reliable curing of UV-sensitive coatings in SMT production environments.
Read more...Automatic stencil cleaning ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
The MBtech N29 series delivers high-precision stencil cleaning with a focus on efficiency, economy and the environment, and is ideal for SMT adhesive and solder paste stencil maintenance.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version