Digi International announced the ConnectCore for i.MX 6UL, a new embedded module platform delivering a connected system-on-module (SOM) with integrated dual-band 802.11ac wireless LAN and Bluetooth 4.1 connectivity in a low-profile, surface-mount form factor slightly larger than a postage stamp.
Built on the new NXP i.MX 6UltraLite applications processor, the module is designed as an intelligent, low-power embedded platform for highly cost-effective and reliable integration into connected devices without the traditional hardware or software design risk, allowing device manufacturers to focus solely on their core competency.
The module’s innovative and patent-pending Digi SMTplus surface mount form factor (29 x 29 x 3,75 mm) enables device manufacturers to optimise product designs by lowering cost and improving capabilities without compromising design flexibility. By providing two integration options (fully featured LGA, and simplified castellated edge vias) in one common form factor, it offers a scalable platform solution that addresses a wide range of product feature requirements, unit cost targets, and levels of design expertise.
Digi’s complete Linux board support package (BSP) plus software support deliver integrated, tested, regular software maintenance based on current, stable community releases. As part of the Linux software support, the new Digi TrustFence device security framework offers the critical features required to protect today’s connected devices and applications. TrustFence implements device security-relevant features such as secure connections, authenticated boot, encrypted data storage, access-controlled ports, secure software updates, and seamless integration of the dedicated on-module secure element (SE).
The ConnectCore 6UL SOM platform deploys an i.MX 6UltraLite applications processor (Cortex-A7 at up to 696 MHz) and PF3000 power management IC from NXP Semiconductors. It boasts up to 2 GB of reliable SLC NAND Flash memory, and up to 1 GB of DDR3, in addition to ultra-low power modes, watchdog, and many other features.
Wi-Fi 6/BLE module enables rapid development Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi 6, and dual-mode Bluetooth/BLE.
Read more...Low phase noise amplifier RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
The MAAL-011158 from Macom is an easy-to-use low-phase noise amplifier that provides 12 dB of gain in a 32-lead QFN plastic package.
Read more...Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Analysis of switch-mode power supply: inductor violations Altron Arrow
Editor's Choice Power Electronics / Power Management
Common switch-mode power supply (SMPS) design errors are discussed, and their appropriate rectification is specified, with details on complications that arise with the power stage design of DC-DC switching regulators.
Read more...Microsoft Windows IoT on ARM Altron Arrow
Computer/Embedded Technology
This expansion means that the Windows IoT ecosystem can now harness the power of ARM processors, known for their energy efficiency and versatility.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
printer friendly version