DSP, Micros & Memory


Memory IC combines NAND and LPDDR

26 June 2019 DSP, Micros & Memory

The new W71NW20KK1KW from Winbond, which combines robust single level cell (SLC) NAND Flash and high-speed, low-power LPDDR4x memory, provides sufficient memory capacity for 5G cellular modems that are intended for use as customer premises equipment (CPE) in homes and offices.

While mobile 5G modems typically require larger memory densities, static 5G CPE modems can operate effectively with memory capacities of 2 Gb NAND or DRAM. By offering this memory combination in a compact single package, the W71NW20KK1KW enables 5G modem manufacturers to meet the system requirements of CPE units at low materials and production costs.

The chip is a 149-ball ball grid array (BGA) package consisting of a 2 Gb SLC NAND Flash die and a 2 Gb LPDDR4x DRAM die. The robust SLC NAND Flash offers enhanced endurance specifications and high data integrity. It only requires 4-bit ECC to achieve high data integrity, but the device’s 2 KB + 128 B page size provides enough space for the use of 8-bit ECC.

The W71NW20KK1KW has an 8-bit bus, and is organised in blocks of 64 pages. The NAND die’s performance specifications include a maximum page read time of 25 µs and a typical page program time of 250 µs.

The LPDDR4x DRAM die, which operates at a high frequency of 1866 MHz, provides an LVSTL_11 interface and features eight internal banks for concurrent operation. It offers a data rate of up to 4267 MT/s, supporting the fast data transfer rates to be offered by 5G cellular networks.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Easy-to-use Wi-Fi module
29 April 2020, iCorp Technologies , Telecoms, Datacoms, Wireless, IoT
The ESP-07S Wi-Fi module was developed by Ai-Thinker Technology. The core processor ESP8266 integrates the advanced Tensilica L106 ultra-low-power, 32-bit MCU (microcontroller) in a small package with ...

Read more...
Bluetooth and Wi-Fi combo module
29 May 2020, iCorp Technologies , Telecoms, Datacoms, Wireless, IoT
FSC-BW121 is a Bluetooth and Wi-Fi combo RF module which supports both Bluetooth 4.2 dual mode and Wi-Fi 802.11 a/b/g/n/ac standards. It requires an external MCU (microcontroller) to execute a Bluetooth ...

Read more...
4G serial routers
29 May 2020, iCorp Technologies , Telecoms, Datacoms, Wireless, IoT
The 4G serial server devices HF2421 and HF2421G provide protocol conversion between RS-232/RS-485/RS-422 interfaces and Ethernet/Wi-Fi and 3G/4G, which can meet the solution requirements for serial/network ...

Read more...
End-to-end IoT developer platform
29 May 2020, iCorp Technologies , Telecoms, Datacoms, Wireless, IoT
ESP RainMaker, introduced by Espressif Systems, is an end-to-end platform that enables makers to realise their IoT ideas faster with Espressif’s ESP32-S2 SoC (system-on-chip) without the hassle of managing ...

Read more...
Industrial-grade 32 GB DRAM modules
29 May 2020, Vepac Electronics , DSP, Micros & Memory
32 GB DRAM modules from Innodisk are the newest industrial-grade, high-capacity DRAM series launched with expanded capacity. Targeted at core network switches for 5G technology – touted as a much faster, ...

Read more...
Microcontrollers for functional safety
29 May 2020, Avnet South Africa , DSP, Micros & Memory
As the Internet of Things (IoT) delivers greater connectivity for industrial and home applications and as connected vehicles enhance cabin and operational features, higher-performance microcontrollers ...

Read more...
Sigfox system-on-chip
29 April 2020, iCorp Technologies , Telecoms, Datacoms, Wireless, IoT
The Uplynx XS8001-NG48NRY is one of ESMT’s family of wireless SoCs (systems-on-chip) designed for ultra-low-power wireless IoT applications. The device monolithically integrates the Sigfox protocol stack ...

Read more...
Enabling cloud connectivity to all Microchip MCUs and MPUs
25 March 2020, Avnet South Africa , DSP, Micros & Memory
Due to the fragmented nature of the Internet of Things (IoT) marketplace, increasing project complexity and costs, today’s developers face more challenges in design decisions than ever before. These challenges ...

Read more...
High-speed DDR4 SDRAMs
29 April 2020, Future Electronics , DSP, Micros & Memory
Alliance Memory has expanded its product offering with a new line of high-speed CMOS DDR4 SDRAMs. For improved performance over previous-generation DDR3 devices, the 4 GB AS4C256M16D4 and AS4C512M8D4 ...

Read more...
Cryptographic MCU protects against malware
29 April 2020, Altron Arrow , DSP, Micros & Memory
With the rapid growth of 5G including new cellular infrastructure, growing networks and data centres supporting expanding cloud computing, developers are seeking new ways to ensure operating systems remain ...

Read more...